Explore the critical role of optical couplers, splitters, and isolators in space applications, where reliable communication and signal integrity are paramount. Learn how these passive components optimize bandwidth usage, enhance data transmission, and protect against reflections and noise in the challenging space environment. Discover the challenges these devices face in extreme conditions and the rigorous testing techniques, including thermal, vacuum, radiation, and mechanical characterization, ensuring their robust performance during space missions.
LISA Pathfinder is paving the way for future missions by testing in flight the very concept of gravitational wave detection: it will put two test masses in a near-perfect gravitational free-fall and control and measure their motion with unprecedented accuracy.
Sensing current by measuring voltage across a resistor is simple and elegant, but issues arise with the electrical interface, sizing and selection, and thermal/mechanical considerations
Electronic Components Thermal shock testing is performed to determine the ability of parts to function properly in an environment with sudden extreme changes in temperature. It is also used for accelerated testing during product evaluation and qualification process.
160 ILLUMINATED PHOTODIODES
Development of a complex setup capable of simultaneously measuring 20 solar sensors under homogeneous incident light
During the last decades, continuous technology improvement has allowed the development of increasingly smaller and cheaper satellites. Different private companies figured out this fact and started to think about the possibilities of having their satellite constellation.
Receiving Inspection is an acceptable activity aimed at confirming that the components received are in accordance with the requirements of the applicable purchase order.
Our inspectors in Alter Technology Group, verify all raw materials by reconciling the purchase order requirements with the packing slip provided by the supplier in terms of:
Parts identification (marking)
Quantity verification
Packing checking
Date code or special restrictions
Documentation review, especially the manufacturer’s Certificate of Compliance
The thermomechanical analysis (TMA) of plastic encapsulated microelectronic, and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices.