Reliability analysis of plastic encapsulated active components exhibiting interfacial delamination in CSAM
- Posted by doEEEt Media Group
- On August 1, 2023
- 0
EEE plastic encapsulated devices are gaining wide acceptance due to their advantages in size, weight, cost, availability performance are state-of-the-art. However, long-term reliability is influenced by its inherent structures and materials
TDK Presentes Robust NTC thermistors for E-mobility
- Posted by doEEEt Media Group
- On August 3, 2020
- 0
The NTC sensor is designed for a temperature range of -40°C to +150°C, whereby a temporary load of up to 200°C is permitted. At 25°C the rated resistance is 10 kΩ with a B25/100 value of 3625 K and a tolerance of ±1 percent.
Modules and balancing of supercapacitors
- Posted by doEEEt Media Group
- On July 29, 2019
- 0
Supercapacitors modules offer better coulombic efficiency, cycle life performance, low temperature performance, and power capability compared to traditional batteries-
Filters and RF Inductors
- Posted by doEEEt Media Group
- On August 17, 2022
- 0
Filters that contain one or more capacitor elements with paper, plastic film, or ceramic dielectric combined with one or more inductive elements in the form of ferrites or chokes are called LC filters. Ceramic capacitors used are of feed-through type, where one terminal consists of the casing soldered or screwed to the chassis. Or there are SMD variants.
Why occur Thermomechanical Failures in Plated Through Vias (PTV)?
- Posted by Francisco Javier Aparicio Rebollo
- On March 6, 2020
- 0
Failures in plated through vias (PTV) can be related to different causes, some of them discussed elsewhere. Amongst them, thermomechanical fatigue is the most frequent failure mechanism observed in plated through systems. Hence, the present post analyses the typical thermally induced failures in PTV architectures.
ALTER Laboratory Services, C-SAM - Short Technical Notes, INSPECTION, ELECTRICAL & VERIFICATION, TESTING
Webinar and Q&A: SAM: Non-destructive inspection of plastic COTS parts and beyond
- Posted by doEEEt Media Group
- On June 14, 2021
- 0
The present communication reports about i) the suitability of advanced acoustic microscopy techniques for the screening of plastic COTS devices susceptible to experience catastrophic failures and ii) the applicability of this technique in the inspection and failure analysis of systems besides COTS such as PCBs, metallic assemblies, hermetic packages, electronic potting, RF devices, and others
Challenges of Testing of Optoelectronics COTS for Space
- Posted by doEEEt Media Group
- On October 27, 2022
- 0
The capabilities of COTS optoelectronics are increasing at the pace of the terrestrial industry, this webinar will give real examples that are being tested today in the different factors that occurring
What is an External Visual Inspection?
- Posted by David Ramirez - Cruzado
- On May 21, 2020
- 0
Consists of a non-destructive optical inspection. Binoculars with magnification between 1x and 60x and with a relatively large and accessible field of view are employed for this purpose.
The aim of this process is to verify the conformity of the exterior of electrical, electronic and electromechanical components (EEE parts) with the acquisition document.