The target is to assess if a fast-testing methodology such as HALT, already in place in other industries as automotive or defense, could be useful to accelerate validation processes on commercial electronic test boards for New Space missions. This project has been developed to be applied to COTS space boards, in a relevant state of maturity, in order to detect and analyze weaknesses after a test failure and try to determine the Fundamental Limit of Technology (FLT) for potentially improving the design phase of the boards.
Inductors, also referred to as coils or sometimes choke, are important passive components along with resistors (R) and capacitors (C). Coils usually refer to wound conductive wires, and among them, those with a single wound wire have in recent years particularly been referred to as inductors.
Supercapacitors (or ultracapacitors) are one of the most progressing capacitor technologies in recent years, offering very high DC capacitance and high energy densities. It is proven its reliable and design flexibility to provide a wide range of energy storage solutions from small wearables, industrial applications, and automotive to large energy power network backup systems.
KEMET is expanding the AO-CAP ® Aluminum Polymer SMD capacitor offering with new A798 Series. The new series was developed and qualified with the news material setting and process flows that allow a life endurance specification of 125ºC and a humidity bias capability of 85ºC/85% relative humidty at rated voltage up to 1000h.
There are two primary capacitor technologies that are most often considered for surface-mount applications: electrostatic and electrolytic. The most common electrostatic types are MLCCs and film capacitors. Due to current bottlenecks in the procurement of surface-mount ceramic capacitors, however, designers are looking for substitutes to keep their production lines running smoothly, and to find long term replacements for hard to find ratings.
A workshop on sensors and sensor interfaces that for a long time has presented advances and disruptive solutions in the fields of software, architecture, design, manufacturing, and materials for sensors and integrated circuits.
Failure analysis is the process of analysing the component data or the component itself to determine the reason(s) for degraded performance or catastrophic failure of a component either, during component manufacturing and testing, during incoming inspection, or after delivery to the customer, at the final application. Since there are an infinite number of variables in play at any one time, it is important as a first step in any failure analysis to understand how and when the failure occurred.