Wafer Sawing

Wafer Sawing Process

Wafer Sawing is the process of singulating the wafer into individual die ready for subsequent assembly.

Alter Technology UK has the capability for a Wafer saw of substrates up to 8” diameter. When dicing of substrates of 12” diameter is required, then ATN UK can process 12” substrates into smaller segments before dicing.

A very thin semiconductor die is required for many System-in-Package (SiP) applications to meet the demanding package form factor requirements.

Our engineers have experience of mounting and dicing thin wafers down to 100um in thickness. Alter Technology UK can also offer Background services and dice before Background processes to singulate die down to as little as 50um thick. In addition to handling very thin die, our company can dice up to 1mm thick substrates.

We have an extensive experience in wafer dicing a wide variety of substrates, including Si, Multi-Project Wafers (MPW), GaAs, GaN, FR4, Glass, Ceramics, and Laminates. Depending on the substrate material and thickness, different dicing blade thicknesses and materials are used.

Important parameters during wafer saw include feed speed, spindle rev, blade height, and water flow.  Important parameters for the washing step include wash time, wash rpm, DI water pressure, dry time, dry rpm, temperature, and airflow rate. As a company, we have developed some optimized wafer saw and wash processes for various MEMS and Sensor devices to avoid damage to the sensitive membrane and optical surfaces.

Alter Technology UK expertise and capability in wafer sawing will reduce risk and reduce time to market for your wafer saw requirements, as well as provide a cost-effective manufacturing option.