Space and HI-REL Assembly

Alter Technology (formerly Optocap), is a leader in the design, manufacture and test of High Reliability Micro and Optoelectronics modules for Harsh Environments. We have experience in a number of high reliability and harsh environment markets such as Aerospace & Defence, Space, Oil & Gas

Focussed areas of excellence

MIL-STD-883 and ESCC Standards

• Die Attach
  • High performance epoxies
  • Solder die attach
  • Pick from film/frame, waffle or gel pack.
  • Flip-chip attach & Au stud bumping
• Wire Bond
  • 17 to 50um Au ball bonding
  • Al wedge bonding
  • Hermetic sealing

• Sealing
  • Seam seal
  • TO Can projection weld
  • Solder seal
  • Vacuum packaging
  • Fine and gross leak test
• QC checks
  • Die shear and wire strength tests
  • Real-time X-RAY
  • Fine and gross leak test
  • Placement accuracy measurements

Test & Screening – Alter Technology

• Parts Engineering
• Component Testing
• EEE Procurement
• Certification
• Radiation testing
• Burn-in & Life Test