Package Design and Modelling
- Posted by doEEEt Media Group
- On March 16, 2020
- 0
Our company utilizes Design for manufacturing techniques to ensure that any designs are compatible with a low-cost, high-yield assembly process, including Package Design and Modelling.
Alter Technology UK mechanical design experience covers custom hermetic packages, precision optical benches, heat spreaders, sub-mounts, and high-power laser coupling.
During package design, selecting suitable component and die-attach materials is given consideration based on the intended in-field use and performance requirements.
Understanding the required environmental operating conditions, thermal, optical, mechanical and electrical requirements are the key to any successful package design activity.
GET IN TOUCH TODAY!
Do you have questions? Contact us!
doEEEt media is the group behind every post on this blog.
A team of experts that brings you the latest and most important news about the EEE Part and Space market.
A team of experts that brings you the latest and most important news about the EEE Part and Space market.
Latest posts by doEEEt Media Group (see all)
- Filtering Characteristics of Parallel-Connected Fixed Capacitors in LCC-HVDC - November 21, 2024
- ALTER SPACE TEST CENTER: testing approaches for New Space - September 30, 2024
- Failure Mechanism of Metallized Film Capacitors under DC Field Superimposed AC Harmonic - September 5, 2024
0 comments on Package Design and Modelling