Photonic Integrated Circuit (PIC) Packaging

Alter Technology UK has experience in assembling and packaging a wide range of Photonic Integrated Circuit (PIC) devices, including Silicon PIC and InP PIC devices.

A PIC is a photonic integrated circuit that integrates multiple photonic functions, such as lasers, detectors, modulators, and splitters, on a single chip.

Due to the high level of functionality within a PIC device, there are several challenges that exist in the assembly and packaging of such devices.

Alter Technology UK have developed a range of fibre coupling process for coupling light into and out of Photonic Integrated Circuit devices, including the following:

For electrical interconnection of PIC devices, Alter Technology UK has experience with Au ball wire bonding, Al and Au Wedge and Ribbon bonding for RF devices.