LED CHIP On Board

• • Increased life span and efficiency
  • System integration, no user-serviceable parts
  • The reduced total cost of ownership
  • Customised array size and shape
  • Application-specific wavelengths
• Chip-on-board vs. surface mounted LEDs:
  • Low-pitch / higher density arrays
  • Improved efficiency and heat dissipation
  • No over-moulding material boosts light output
  • Fewer interconnects reduce reliability risk

Why Alter Technology UK?

• Value Proposition
  • Experienced LED CoB module provider
  • The flexible and customisable platform
  • Reduced time to market
    • Product-specific experience and processes
    • Established material supply chain
  • Reduced technical risk
    • Existing design and process knowledge
    • Rapid prototyping on production tools
  • Reduced cost
    • No capex requirement for customer
    • Volume manufacturing capacity
    • >200K LED placements per month.
• Concept to a product:
  • Substrate design & sourcing, ceramic, IMS, FR4.
  • Sourcing tested & binned LED dies
  • Optical and thermal modelling
  • Full range of volume assembly services
  • Functional test
  • Characterisation

Assembly Capabilities

• Die Attach
  • Ag epoxy stamping or dispense
  • Sintering epoxy materials
  • Soldering
  • Pick from film/frame, waffle or gel pack.
  • Flip-chip attach & Au stud bumping

• Wire Bond
  • 17 to 50um Au ball bonding
  • Plasma clean for improved adhesion
  • Encapsulation Options
  • Frame laser cutting and attach
  • Glass cover attach
  • Silicone encapsulation
  • Dome attach
  • Specialist processes for mixing and degassing

• QC checks
  • Die shear and wire strength tests
  • Placement accuracy measurements