Laser Diode Packaging

Alter Technology UK offers customers support in prototype/process development for laser diode packaging and volume manufacturing capability.

By prototyping on the volume manufacturing tool-set, Alter Technology UK can offer a risk-free transition to manufacturing with a fully optimized and high-yield process.

A summary of Alter Technology UK laser diode packaging expertise can be found below;

• Process Highlights
  • Placement accuracies from +/- 1µm to +/-20µm
  • Fully automated or manual placement
  • Adjustable band force
  • 3-axis placement control
  • Void-free Eutectic die to attach
  • Control of flatness “smile.”
  • Epi-side down or up assembly
  • Vacuum reflow processes

• Materials
  • GaAs or InP
  • Size
    • Laser bars in excess of 10mm
    • Laser single emitters to 5mm
• Package Type
  • C-mount (standard sizes of 4mm to 5mm, sharp edge for accurate placement)
  • CS-mount
  • TO-can
  • Stacks

• Eutectic solder processes including AuSn, SnAg, InAg, SnPb, BiSn (preforms, pre-deposited substrates to control solder overspill
• CuW/Cu/AlN/CuW/CVD Diamond sub-mounts and heat-sinks

Alter Technology UK’s expertise and capability in Laser Diode Packaging will reduce risk and reduce time to market for your laser diode packaging requirements, as well as provide a cost-effective manufacturing option.