Holm conference provides a forum for the presentation and discussion of the latest developments in the field of electric contacts and the application of recent advances in materials and processes in electric, electronic and telecommunication equipment.
14th International Microsystems, Packaging, Assembly and Circuits Technology Conference IMPACT-IAAC 2019 Conference, which is organized by IEEE EPS-Taipei, iMAPS-Taiwan, ITRI, and TPCA, is the largest gathering of packaging and PCB professionals in Taiwan. This year will be held in conjunction with TPCA SHOW 2019 on Oct. 23th-25th at Taipei Nangang Exhibition Center. For grasping […]
"IEEE CPMT Symposium Japan (ICSJ)" is one of the most widely recognized international conferences sponsored by the IEEE EP Society and has been held annually in Kyoto in November. The conference originally started in 1992 as "The VLSI Packaging Workshop in Japan" and was renamed to "ICSJ" in 2010. ICSJ will provide a platform for […]
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemination of latest research in the areas of electrical design of chip, package, and system. Designers and researchers across the world come forth to share and discuss their work on all aspects of electrical packaging including modeling, design and simulation, fabrication and characterization.
