The IEEE Workshop on Signal and Power Integrity (SPI) is an exchange forum on the latest research and development in design, characterization, modeling, simulation and testing of Signal and Power Integrity at the chip, package, board and system level. The workshop brings together developers and researchers from industry and academy to foster cooperation.
The technical programme of SPI2019 will include oral and poster sessions. Several leading experts will provide tutorials on areas of emerging interest. Conference Proceedings will be published with an ISBN code and will appear on IEEE Xplore.

TOPICS OF INTEREST

• Modeling and simulation for SI/PI
• Coupled Signal and Power Integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nanostructures
• Electromagnetic theory and modeling
• Transmission line theory and modeling
• Macromodeling and reduced order models
• Electromagnetic compatibility
• Design methodology/flow
• Measurements
• Jitter and noise modeling
• Stochastic/sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects