NordPac 2019 – The Nordic Conference on Microelectronics Packaging

As part of the annual IMAPS Nordic conference, doctoral and master’s students are especially encouraged to submit a summary of relevant research and papers about Microelectronics Packaging.
This is a great opportunity to interact with the industrial and academic community at an international level.

TOPIC OF STUDIES AND PAPERS

• Printed, flexible electronics
• Unique materials, PTF and ACF
• High-temperature electronics, harsh environment
• 3D Advanced interconnect, advanced packaging
• Ceramics: thick film, copper plated, DBC, LTCC

• Medical electronics
• OPTO-ELECTRICAL and LED
• Sensor integration & applications
• Wearable electronics
• Reliability assessments, SPC and FMEA