iMAPS 2019

The 52nd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2019 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session.

TRACK 1: SiP/SiM/CPI (System Solutions)

TOPICS:

• System Design & Integration
• CPI & Modeling
• Embedded/High Voltage
• Optical/Automotive
• Wearable / IoT
• System Partitioning / EMI Shielding
• Computing & Networking
• Package Assembly Design Kit (PADK) & Process Design Kit (PDK)

TRACK 2: Wafer Level/Panel Level (Advanced RDL)

TOPICS:

•  Wafer-Level Fan Out
• WLCSP
• Advanced Fan Out & Heterogeneous Integration
• Panel-Level Fan Out
• MEMS & Sensors
• Edge Protection
• Carrier Technologies
• Reliability & Test

TRACK 3: High Performance / High Reliability

TOPICS:

•  High Reliability – Defense/Aero
• MM Wave / High-Speed Packaging
• RF/Wireless Components
• High Reliability in Bio/Medical
• High Reliability in Extreme Environments

TRACK 4: Flip Chip/2.5D/3D/Optical (Advanced Package)

TOPICS:

•  Large Body / Small Body FC
• 2.5D Technologies
• Optical / Photonics
• BUMP & Interconnect
• 3D Technologies
• 5G Applications
• Heterogeneous Integration

TRACK 5: Advanced Process & Materials (Enabling Technologies)

TOPICS:

• Advanced Equipment for Additive Manufacturing
• Flexible Electronics
• Substrate Technology
• Polymer Materials & Processes
• Novel Materials & Processes
• Advanced Wirebond