IEEE ECTC 2019 Las Vegas

The 69th Conference on Electronic Components and Technology (ECTC) which brings together science, technology and education in packaging, components and microelectronic systems in an environment of international technical cooperation and exchange.
ECTC 2019 will feature some 40 technical sessions (oral, interactive and poster presentations), 16 professional development courses, a panel discussion, a plenary session, an EPS seminar and a technology corner for exhibitors.

The technical programme will discuss cutting-edge developments and technical innovations across the entire packaging spectrum. Topics include advanced packaging, modeling and simulation, photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.

Thanks to the Roundtable, Plenary Session and Seminar of the CPMT it is possible to offer a format for exchange and between the presenters and the audience. In this way, conference participants have the opportunity to gain the vision and perspective of technical and business leaders.

From the Technological Corner and complementing the Technical Program, companies are given the opportunity to exhibit their products and services in an environment that allows discussion and interaction with managers and engineers attending the ECTC.