Thermo-Conductive Gap Filler

Introduces for Würth Elektronik

Conduct Heat, No Current

With its WE-TGF (Thermal Gap Filler) Würth Elektronik now offers a new solution for heat dissipation.

The outstanding feature of the self-adhesive gap-filler material: The non-conductive barrier with high dielectric strength has a high thermo conductivity index of 1 W/(m*K).

The material easily adapts to the differing thicknesses of components on the PCB and fills the gaps between hot electronic components and metal casings or cooling components.

WE-TGF is made of silicone incorporating ceramic particles. For applications in which the PCB is screwed onto a metal plate, the material is also reinforced with a glass-fibre mesh.

The thermoconductive gap filler is suited for use e.g. in:

• power electronics
• entertainment technology
• networking devices

WE-TGF is available ex stock in a variety of dimensions and in thicknesses ranging from 0.23 to 5 mm. Developers working in the prototype construction area can request individually cut samples, which are shipped within 48 hours of ordering. Customization comes at no extra charge for the customer.