Lead-free Transition for the European Space Sector

Market Pressures

• Due to the overall transition of the Electronics Industry worldwide to a Pb-free realm, the Space Industry is more and more confronted with a situation where they cannot avoid using EEE parts with Pb-free coatings and they need to manage the associated risks. 
• The growing use of commercial components (COTS), notably for the expanding market sector of constellations, means that European Space Industry is already using large amount of components with lead-free terminations even when the equivalent leaded high-rel version is available.
• Market pressure may also result on potential future difficult availability of leaded solder paste 
• In order to prepare for that future risk, the European Space Industry will need to introduce lead-free soldering processes, an extensive and very expensive undertaking for the European space Industry
• Changing to lead-free soldering is not required for massive COTS introduction

SCSB Decision

• Taking into account of all these, in 2019 the SCSB agreed to launch a joint task force consisting of MPTB and CTB members to:

In the domain of EEE components, electronic assembly technologies and PCBs, ensure a successful industry-wide transition to a Pb-free technology while preserving or improving current levels of quality and reliability

Task Force Composition

• ESA
• CNES
• DLR
• UKSA
• ADS
• ARIANEGROUP
• CTB Chairman
• TAS
• ALTER
• RUAG
• ReachLaw
• MPTB Chairman
• Continental (Observer)

Main Preliminary Conclusions COTS use:

• There is enough data on the reliability of SnPb solder joints (other than Tin-whisker risk) for all lead-free terminations of EEE parts (COTS and others) that the Space Sector currently use or wish to use.
• The only action required is to modify the applicable European standards to allow the use of those EEE parts with lead-free terminations
• Tin-whisker risk can be adequately managed using existing North-American GEIA and JESD standards. However the Task Force is of the opinion that a European version for those standards is desirable.

Main Preliminary Conclusions Soldering:

• Concerning the timing to change the soldering processes to eliminate lead:

• • In the short term (< 5 years) : no risk associated with Regulation or obsolescence of SnPb solder

• • Medium term (< 10 years) : no risk from Regulation and very low risk associated with SnPb solder obsolescence

• • Long term (> 10 years) : very low risk from the Regulatory side and potential risk associated with SnPb materials obsolescence.

• If someone wishes to go to lead-free soldering in the short term, reliability data available for SAC 305 make it possible to change today. For those that can wait, other, probably better, lead-free solders are being developped

Next Steps

• The Task Force should deliver a Roadmap for Lead-free Transition at the end of the year