Releases Very Fast-Acting Thin Film Chip Fuse

for Automotive Applications

Vishay Intertechnology is releasing a new very fast-acting thin film chip fuse featuring current ratings from 0.5 A to 5.0 A. The device delivers outstanding stability of fusing characteristics for E.V.s and HEVs.

Vishay Intertechnology, Inc. introduced a new very fast-acting thin film chip fuse. The Vishay Beyschlag MFU 0603 AT is AEC-Q200 qualified and features current ratings from 0.5 A to 5.0 A for automotive applications.

The device released today will be used in electric (E.V.) and hybrid electric (HEV) vehicles. It will protect voltage sensing circuits in battery management systems and circuit protection for small loads. For these applications, the fuse’s highly controlled thin-film manufacturing process guarantees outstanding stability of fusing characteristics.

Offering a robust design, the MFU 0603 AT consists of a homogeneous metal alloy film deposited on a high-grade ceramic substrate, with fuse elements covered by a protective coating designed for electrical, mechanical, and climatic protection. The device offers advanced sulfur resistance by ASTM B 809, and it withstands 85 °C / 85 % R.H. for 1000 h biased humidity testing and testing for thermal shock.

Offered in the 0603 case size, the fuse features a rated voltage of up to 63 V, a breakdown capacity of 50 A, and an operating temperature range of -55 °C to +125 °C. RoHS-compliant, halogen-free, and Vishay Green, the fuse is suitable for processing automatic SMD assembly systems and automated soldering using wave, reflow, or vapor phase.

Samples and production quantities of the MFU 0603-FF AT are available now, with lead times of 10 to 14 weeks.