PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

DC power – Use of Substrate Attach Strength – Die Shear Strength Method

Posted by José Cándido Vázquez Cárdeno
On February 13, 2019
0

The purpose of the test is to determine the strength of the element attachment system when subjected to force in the Y1 axis, and thus to determine the integrity of materials and processes used to attach semiconductor die or surface mounted elements to package headers or other substrates. The implementation of this test includes material evaluation and process control.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Test Methods in Electronic parts. The Vibration Tests

Posted by María Teresa Rodríguez
On February 13, 2019
2

The purpose of vibration tests is to evaluate the effect caused on component parts by vibration in a specified frequency range. The samples are subjected to testing under different conditions, as described below, in accordance with the respective applicable standards. The test conditions differ in terms of duration, frequency range, vibration waveform, amplitude, etc.