INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Working process of C-SAM in EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On March 28, 2019
0

Scanning Acoustic Microscopy (C-SAM) for the non-destructive internal inspection of Microelectronic Parts: How it Works and Physics Fundamentals.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Thermographic analysis Techniques used for EEE Parts

Posted by Emilio Cano García
On March 28, 2019
0

Thermographic analysis techniques used in Alter Technolgy : Infrared camera thermal maps, Thermal behavior of equipment and cabinets, Thermal analysis at customer specified temperature conditions. The analysis of the distribution of the dissipated heat in cabinets or enclosures gives relevant information for checking the reliability of a system and its components.

ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

Thermal Vacuum Testing for Space Applications

Posted by doEEEt Media Group
On March 28, 2019
0

The environmental conditions in the space are extreme, the combination of low pressure and the extreme temperatures can cause the failure of a component. That is why we test the components in similar conditions.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Different types of Corrosion / Contamination in Crimped Connectors

Posted by Francisco Javier Aparicio Rebollo
On March 14, 2019
0

Crimped connectors are gas-tight junctions ideally protected against environmental contaminants and corrosive agents. Nonetheless inappropriate crimping and inherent connector and wire defects reduce this protection. Thus, depending of the storage atmosphere, non-conducting corrosion products can be formed, or stress corrosion cracking can be eventually induced. The former act as insolation layer that reduces the connector conductivity and both corrosion effects are identified as critical factors involved in common fails reported for electrical connectors.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Reasons to do an Element Evaluation Procedure of EEE Parts

Posted by doEEEt Media Group
On March 14, 2019
1

Element evaluation is performed on a sample of randomly selected parts from a production lot, (if die, they are assembled into packages). These parts are then subjected to a series of tests selected to verify the reliability of the parts (Electrical, screening, environmental, endurance and mechanical tests) and the production lot from which they originated. The Element Evaluation is performed to show that the parts performance, materials and manufacturing processes are able to meet their specified electrical, mechanical and physical performance characteristics for which they were designed-and as a result, their suitability for use in the application in which they are intended to be used.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Identifying Leakage Pathway with a Penetrant Dye Gross Leak Test

Posted by David Ramirez - Cruzado
On March 13, 2019
0

Penetrant dye gross leak test is used to identify leakage pathways within hermetic and non-hermetic devices, such as glass body devices or plastic encapsulated parts. The test provides a definitive view of the leak paths including cracks, voids, delaminations and other fractures.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Discover a PCB Failure Analysis: the Pad Cratering

Posted by Mari Carmen López
On March 11, 2019
0

One of the major failure modes encountered in PCB assembly is Pad cratering. This term is coined to describe a fracture at the pad/resin interface (adhesive failure) or within the resin beneath pads (cohesive failure) that extend along the whole pad length (see the figure) and leads to the complete separation of the pad from the PCB. This failure mode is especially relevant for assembled BGA, CGA and bottom termination components fabricated by lead-free and halogen-free processes and it is related to mechanical stresses experienced in PCB systems.

ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

Know all the characteristics of a HAST test?

Posted by Álvaro Ricca Soaje
On February 21, 2019
0

HAST test reduces the time it takes to complete the typical humidity 85 ºC / 85% RH testing for semiconductors (96 HAST hours are equivalent to 1000 THB hours). By elevating temperatures above 100°C (usually up to 130°C) and increasing the pressure, simulation of normal humidity tests can be made while maintaining the same failure mechanisms.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

DPA parts examination used for Electrical Components

Posted by doEEEt Media Group
On February 20, 2019
0

Destructive Physical Analysis DPA is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

DC power – Use of Substrate Attach Strength – Die Shear Strength Method

Posted by José Cándido Vázquez Cárdeno
On February 13, 2019
0

The purpose of the test is to determine the strength of the element attachment system when subjected to force in the Y1 axis, and thus to determine the integrity of materials and processes used to attach semiconductor die or surface mounted elements to package headers or other substrates. The implementation of this test includes material evaluation and process control.

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