What does Acceptance Quality Limit (AQL) mean?
- Posted by doEEEt Media Group
- On July 19, 2020
- 0
This post gives very general concepts of Acceptance Quality Limit (AQL) getting the user familiar with AQL Tables
Evaluation of Electronic Assemblies
- Posted by Mari Carmen López
- On July 18, 2020
- 0
Assembly process of THT or SMT onto PCBs for spacecraft applications follow well-established design requirements based on specifications prepared by ECSS (ECSS-Q-ST-70-08C & ECSS-Q-ST-70-38C), NASA and IPC (IPC-6012).
Failure Analysis in Microsection Inspection
- Posted by Mari Carmen López
- On July 10, 2020
- 0
Microsection analysis is performed on an assembled through hole device as a part of a failure analysis. Cross-section through the plane of interest can provide helpfully information about solder defects, PCB inner layers and internal construction. As a part of a failure analysis, the plane of interest has to be selected taking into account PCB characteristic, observed failure and previous test results.
New Space and the use of Radiation simulation tools
- Posted by Amor Romero
- On July 9, 2020
- 0
The use of radiation tools is justified as a complement of radiation test to verify and optimize the radiation hardness assurance process in the new space market and reduce some cost without a significant loss of the confidence level.
Product Assurance Approach Questions & Answers
- Posted by doEEEt Media Group
- On July 9, 2020
- 0
In this post, you can read all the questions launched by the attendees, as well as all the answers offered by the speaker.
C-SAM Questions & Answers
- Posted by Francisco Javier Aparicio Rebollo
- On July 7, 2020
- 0
In this post, you can read all the questions launched by the attendees, as well as all the answers offered by the speaker.
How to protect your COTS parts during C-SAM inspections
- Posted by Francisco Javier Aparicio Rebollo
- On July 7, 2020
- 0
The current post describes the different measures taken during Scanning Acoustic Microscopy (SAM) inspection to avoid potentially harmful effects associated with water immersion. Internal visual inspection conducted after decapsulation shows the successful prevention of corrosion phenomena in these samples.
Non-destructive internal inspection of EEE parts and passive components
- Posted by Francisco Javier Aparicio Rebollo
- On July 7, 2020
- 0
Non-destructive testing methods are critical for the screening, inspection and failure analysis of plastic encapsulated and other EEE systems.
Need a 3D Characterization Testing? Use Scanning Microscopy CLSM
- Posted by Fernando Teberio
- On July 2, 2020
- 1
Modern manufacturing techniques depend on 3D measurement data combined with CAD/CAM techniques for quality control of high-precision components or mass production. Typically, contact measurement has been widely utilized by the industry. However, for complex and small 3D structures, the application of contact measurement is cumbersome or sometimes impossible. Therefore, noncontact measurement has gradually received much attention from researchers and industry.
Scanning Acoustic Microscopy – Webinar
- Posted by doEEEt Media Group
- On June 17, 2020
- 2
This webinar provides a brief overview of Scanning Acoustic Microscopy and the inspection of EEE parts. Thus, you will acquire, in a friendly way, the knowledge to interpret SAM images and to conceive basic SAM inspections. The webinar is mainly focused on the plastic encapsulated systems. In addition, we will also show other interesting application examples.