ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

Temperature and Humidity Test, main reason to perform it.

Posted by Francisco Javier Aparicio Rebollo
On October 24, 2020
2

Humidity may affect the life expectancy of a component by creating stresses on the part materials and altering its electrical properties in a way that the component reliability is significantly diminished. Temperature Humidity Test is those performed with the aim of evaluating the properties of materials used in components and the reliability of non-hermetic packaged devices in humid environments.

ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

How to perform an Environmental Test?

Posted by Javier Alejandro de la Ossa Fernández
On October 21, 2020
0

Performing an environmental test means subjecting the device or system to certain environmental conditions (cold, dry heat, relative humidity, etc.) in order to check if the operational parameters remain within the range defined by the applicable regulations.

ABC of CLR, EEE Components, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Mounting Guidelines: Soldering, PCB Handling & Rework

Posted by Tomáš Zedníček
On October 18, 2020
1

What are the optimum soldering conditions and solder fillet? The best solder fillet for all SMT applications is one which makes a reliable connection and which best withstands the environmental exposures of the products with minimum degradation. This fillet is difficult to describe quantitatively for all parts. The optimum fillet ranges in height from about 1/3 to 2/3 of the part termination height. This does not mean that all solder joints outside of this range should be repaired. It does mean that this is the target for the process engineer to reach for in his process. As many as possible of the solder fillets on the board should be in this range.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Bond Pull Test

Posted by Jesús Enrique Barbero Muñoz
On October 14, 2020
0

The purpose of Bond Pull Test is to measure bond strengths, to evaluate bond strength distributions and to determine compliance with specified bond strength requirements of the applicable acquisition document in order to ensure the proper manufacturing process and long-term reliability of the bonds under stress conditions, such as vibration, shock, thermal cycling or wearout phenomena.

ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

Objectives and Methods of Thermal Cycling Testing in EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On October 14, 2020
0

The objective of thermal cycling testing is to determine the ability of parts and solder interconnects to resist extremely high and low temperatures, as well as their ability to endure cyclical exposures to extreme temperatures.

ALTER Projects, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

SENTINEL 3A

Posted by doEEEt Media Group
On October 14, 2020
0

The Sentinels are a fleet of satellites designed to deliver the wealth of data and imagery that are central to the European Commission’s Copernicus programme.

EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, TESTING

Analysis of Multi-Layer Ceramic Capacitors

Posted by doEEEt Media Group
On October 14, 2020
0

This paper presents an overview of MLCCs characteristics that are of interest when used in power integrity (PI) analysis of automotive electronic systems.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Understanding the use of Thermoreflectance Thermal Imaging

Posted by Francisco Javier Aparicio Rebollo
On October 11, 2020
0

Submicrometric-nanometric objects nowadays present in the design of integrated circuits induce singular heat transport phenomena leading to the formation of hot-spots or strong temperature gradients at specific focal points, which compromises the suitable operation and reliability of microelectronic systems and can potentially decrease the lifetime.

ALTER Projects, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

PLAnetary Transits and Oscillations of stars PLATO

Posted by Alvaro Real
On October 9, 2020
0

Alter Technology is the coordinated procurement agency for all the electronic components on-board providing engineering, testing and logistics services helping to the The European Space Agency (ESA) in the new mission with the PLAnetary Transits and Oscillations of stars (PLATO); which has the goal to detect terrestrial exoplanets in the habitable zone of solar-type stars and characterizing their bulk properties from 2024 onwardsplato.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Mechanical Shock Test for Electronic devices

Posted by María Teresa Rodríguez
On October 8, 2020
0

The purpose of mechanical shock testing is to evaluate the reliability of devices subjected to severe shocks which might result from suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation.

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