EEE Components, ENDURANCE, ENVIRONMENTAL & RADIATION, Microsectioning - Short Technical Notes

Inspection of conformal coating on PCB using UV Light

Posted by Mari Carmen López
On August 4, 2020
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The aim of the external inspection of coated PCA is to determine if all the surfaces and devices are adequately covered. In order to make easy such inspection, fluorescing agents can be added to the polymeric formulation, which shows a blue glow when the PCA is exposed to ultraviolet (UV) light.

Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Plating Thickness Testing Overview in Alter Technology Lab.

Posted by Mari Carmen López
On July 28, 2020
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Cross-sectioned ceramic capacitors were metallographically prepared in the Materials & Processes Laboratory, recognized as a recommended facility for such activity by the ESA authority (MEMO ESA-TECMSP-MO-013165).

Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Evaluation of PCB in Alter Technology Lab.

Posted by Mari Carmen López
On July 25, 2020
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The separation of the interest area has to be performed in such a way as to prevent any damage by deformation or input of heat. After cleaning, the specimen is encapsulated before the grinding process takes place.

Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Evaluation of Electronic Assemblies

Posted by Mari Carmen López
On July 18, 2020
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Assembly process of THT or SMT onto PCBs for spacecraft applications follow well-established design requirements based on specifications prepared by ECSS (ECSS-Q-ST-70-08C & ECSS-Q-ST-70-38C), NASA and IPC (IPC-6012).

Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY

Failure Analysis in Microsection Inspection

Posted by Mari Carmen López
On July 10, 2020
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Microsection analysis is performed on an assembled through hole device as a part of a failure analysis. Cross-section through the plane of interest can provide helpfully information about solder defects, PCB inner layers and internal construction. As a part of a failure analysis, the plane of interest has to be selected taking into account PCB characteristic, observed failure and previous test results.

EEE Components, Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Microsectioning inspection of assembled capacitors

Posted by Mari Carmen López
On May 9, 2020
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Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Assembled Resistors. Incomplete wetting

Posted by Mari Carmen López
On January 15, 2020
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Resistors assembled to a PCB have been submitted to the ECSS verification program. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).

EEE Components, Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MacroVoids in assembled BGA packages

Posted by Mari Carmen López
On August 14, 2019
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BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).

Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY

Constructional Analysis in Microsection Inspection

Posted by Mari Carmen López
On July 23, 2019
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Cross-section analysis is a very useful way of determining the construction and material composition of electronic devices. The FP device is potted in epoxy resin. After curing, the sample is sequentially grinded up to reach the plane of interest. Then, the specimen is subjected to several polishing steps to achieve a high-quality surface to be analyzed by metallographic microscopy.