INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Different types of Corrosion / Contamination in Crimped Connectors

Posted by Francisco Javier Aparicio Rebollo
On March 14, 2019
0

Crimped connectors are gas-tight junctions ideally protected against environmental contaminants and corrosive agents. Nonetheless inappropriate crimping and inherent connector and wire defects reduce this protection. Thus, depending of the storage atmosphere, non-conducting corrosion products can be formed, or stress corrosion cracking can be eventually induced. The former act as insolation layer that reduces the connector conductivity and both corrosion effects are identified as critical factors involved in common fails reported for electrical connectors.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Reasons to do an Element Evaluation Procedure of EEE Parts

Posted by doEEEt Media Group
On March 14, 2019
1

Element evaluation is performed on a sample of randomly selected parts from a production lot, (if die, they are assembled into packages). These parts are then subjected to a series of tests selected to verify the reliability of the parts (Electrical, screening, environmental, endurance and mechanical tests) and the production lot from which they originated. The Element Evaluation is performed to show that the parts performance, materials and manufacturing processes are able to meet their specified electrical, mechanical and physical performance characteristics for which they were designed-and as a result, their suitability for use in the application in which they are intended to be used.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Identifying Leakage Pathway with a Penetrant Dye Gross Leak Test

Posted by David Ramirez - Cruzado
On March 13, 2019
0

Penetrant dye gross leak test is used to identify leakage pathways within hermetic and non-hermetic devices, such as glass body devices or plastic encapsulated parts. The test provides a definitive view of the leak paths including cracks, voids, delaminations and other fractures.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Discover a PCB Failure Analysis: the Pad Cratering

Posted by Mari Carmen López
On March 11, 2019
0

One of the major failure modes encountered in PCB assembly is Pad cratering. This term is coined to describe a fracture at the pad/resin interface (adhesive failure) or within the resin beneath pads (cohesive failure) that extend along the whole pad length (see the figure) and leads to the complete separation of the pad from the PCB. This failure mode is especially relevant for assembled BGA, CGA and bottom termination components fabricated by lead-free and halogen-free processes and it is related to mechanical stresses experienced in PCB systems.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Alter Technology SAM Internal procedure

Posted by Francisco Javier Aparicio Rebollo
On January 22, 2019
0

Some specific user requirements cannot be fulfilled by QPL parts (scientific missions). In these situations, plastic encapsulated COTSs are investigated. We comply with the applicable specification so that in this case they comply with the applicable specification. If the plastic encapsulated COTS with the required functionality does not meet the rejection criteria of conventional test methods, Alter Technology, with internal criteria for the assessment of plastic encapsulated COTSs, and the final user agree on a set of new rejection criteria for lot acceptance by considering the actual working conditions plus additional validation test flow based on the expected use.

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