INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Alter Technology SAM Testing Capabilities

Posted by Francisco Javier Aparicio Rebollo
On June 17, 2019
0

Scanning Acoustic Microscopy Service A-scan, B-scan, C-scan, and Through-scan Circuit, non-circuit, and through-transmitted signal are systematically inspected at different focal depths Delamination (phase inversions) is confirmed by A-scan mode

EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, TESTING

AVX CDR11 to 14 with BG Dielectric no longer offered

Posted by José Francisco Largaespada
On June 14, 2019
0

AVX will cease to manufacture MIL-PRF-55681/4 styles CDR11, CDR12, CDR13, and CDR14 with the BG dielectric. (90 ± 20ppm). AVX will continue to support same styles with BP dielectric (0±30ppm).

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

XPS, how it works and its applications in EEE parts

Posted by Francisco Javier Aparicio Rebollo
On May 30, 2019
0

X-ray photoemission spectroscopy (XPS) also known as electron spectroscopy for chemical analysis (ESCA) is a surface-sensitive quantitative analysis method to accurately determine the elemental composition of solid materials. The technique is the most extended tool for the chemical characterization of thin films coatings and surfaces either for industrial applications as well as for research

ACTIVES, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Flow Stages in Vibration Testing on Hi-Rel EEE Parts

Posted by María Teresa Rodríguez
On May 25, 2019
0

Depending on the intended application electrical components are exposed to either transitory or permanent dynamic mechanical stress which can impair the performance (e.g. mechanically induced crack in PCBs systems or fretting corrosion in connectors and others).

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

XRF tool, how it works and its applications in EEE parts

Posted by Francisco Javier Aparicio Rebollo
On May 16, 2019
0

XRF is a non-destructive and quick analytical tool to determine the chemical elements present in the specimen. In particular, it combines low detection limit (particularly in the case of heavy elements) with quick and easy sample preparation.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

What is SEM EDS as Internal Material Analysis?

Posted by Francisco Javier Aparicio Rebollo
On May 2, 2019
0

This analytic technique may provide both qualitative and quantitative information of the composition of a surface, i.e. identification of the elements and the element weights, respectively. The technique relies on the detection and spectroscopy of secondary radiation (X-Ray) emitted when a high-intensity incident beam of electrons impinges upon the materials placed in its path. The SEM – EDS Internal Material Analysis (also known as EDX or EDAX) can be performed in accordance with MIL-STD-883, MIL-STD-750, MIL-STD-1580 and ESCC 25500 requirements.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Tin Whisker Growth Investigation Conclusions

Posted by Dimas Morilla
On April 4, 2019
2

It is important to be vigilant in the procurement of electronics components, particularly for space components, because once launched, they cannot be repaired and many spacecraft have intended lives of 14 years and some like Pioneer will continue communicating with Earth for more than 40 years.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

How and Why Tin Whisker Grow in Electronic components

Posted by Dimas Morilla
On April 4, 2019
0

The Tin Whisker is a conductive hairy-like crystalline structure of tin that grow spontaneously from a tinned surface, usually as a result of the stress of some sort, and maybe long enough to cause a big problem for those applications demanding a high level of reliability.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Working process of C-SAM in EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On March 28, 2019
0

Scanning Acoustic Microscopy (C-SAM) for the non-destructive internal inspection of Microelectronic Parts: How it Works and Physics Fundamentals.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Thermographic analysis Techniques used for EEE Parts

Posted by Emilio Cano García
On March 28, 2019
0

Thermographic analysis techniques used in Alter Technolgy : Infrared camera thermal maps, Thermal behavior of equipment and cabinets, Thermal analysis at customer specified temperature conditions. The analysis of the distribution of the dissipated heat in cabinets or enclosures gives relevant information for checking the reliability of a system and its components.

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