ACTIVES, C-SAM - Short Technical Notes, EEE Components, TESTING

Thermo-mechanical Analyser – TMA – capabilities

Posted by Raquel Cano Cordero
On October 5, 2021
0

The thermomechanical analysis (TMA) of plastic encapsulated microelectronic and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices.

C-SAM - Short Technical Notes

C-SAM Industry Applications

Posted by doEEEt Media Group
On July 8, 2021
0

During the last decades, SAM has proved to be a reliable and powerful tool for the non-destructive inspection in different sectors such as: > Space > Defense and Aerospace > Automative > Power and energy > Martials analysis: ceramics and composites

C-SAM - Short Technical Notes, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, TESTING

Non-Destructive Detection of Delaminations in PCBs Assemblies

Posted by Raquel Cano Cordero
On March 10, 2021
0

Scanning Acoustic Microscopy (C-SAM) inspection has been used for the comprehensive inspection of the lead-frame in a horizontally stacked capacitor. This non-destructive inspection reveals minor anomalies at the interface with capacitor terminals which may impair the electrical response.

C-SAM - Short Technical Notes, COTS components

How to protect your COTS parts during C-SAM inspections

Posted by Francisco Javier Aparicio Rebollo
On July 7, 2020
0

The current post describes the different measures taken during Scanning Acoustic Microscopy (SAM) inspection to avoid potentially harmful effects associated with water immersion. Internal visual inspection conducted after decapsulation shows the successful prevention of corrosion phenomena in these samples.

C-SAM - Short Technical Notes, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, TESTING

Scanning Acoustic Microscopy (C-SAM) of in Stacked Capacitors

Posted by Francisco Javier Aparicio Rebollo
On June 12, 2020
0

C-SAM - Short Technical Notes, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Ultrasonic Examination of Ceramic Capacitors by Scanning Acoustic Microscopy

Posted by Francisco Javier Aparicio Rebollo
On May 18, 2020
0

Ultrasonic Examination of Ceramic Capacitors by Scanning Acoustic Microscopy (SAM) has proved to be the most effective tool for the non-destructive detection of very thin (even below 200 nm of thickness) internal anomalies (delamination, voids, cracks, and foreign material) within ceramic capacitors and other EEE parts

C-SAM - Short Technical Notes, Plastic Packaging for Space

C-SAM: Crack detection within plastic packages

Posted by Antonio José Rey
On May 8, 2020
0

Package crack/void between non-connected terminals is a critical anomaly in plastic encapsulated parts. This is so as these can turn into a conductive path and lead to catastrophic failures. In this regard, Scanning Acoustic Microscopy (SAM) is the most effective non-destructive approach for the sensitive detection of such deviations within plastic packages.

C-SAM - Short Technical Notes, EEE Components, PASSIVES, TESTING

Non-destructive detection of micrometric internal features within EEE microelectronic systems.

Posted by Francisco Javier Aparicio Rebollo
On September 3, 2019
0

Micrometric-wide internal features of sub-micrometric thickness can be easily detected in our recently upgraded instrument. The high lateral resolution is within the current state of the start in the non-destructive inspection of deeply embedded objects.

C-SAM - Short Technical Notes, EEE Components, PASSIVES, TESTING

Acoustic Inspection of Hybrid Systems on Laminated Substrates

Posted by Francisco Javier Aparicio Rebollo
On September 3, 2019
0

BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).

C-SAM - Short Technical Notes, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Water ingress through delaminated parts in plastic encapsulated systems

Posted by Francisco Javier Aparicio Rebollo
On July 25, 2019
0

High-current low dropout regulator encapsulated in a TO-263 package is inspected by scanning acoustic microscopy. Probe frequency and inspection procedure is adapted to system characteristics. In this case the architecture of the system includes features at different depths within a thick package.

Page 1 of 212