Packaging and Assembly, Packaging Applications

Flip Chip

Posted by doEEEt Media Group
On November 12, 2020
0

Flip chip (also known as direct chip attach) is the process whereby a semiconductor die is attached bond pad side down to a substrate or carrier. The electrical connection is made by means of a conductive bump on the die bond pad.

Packaging and Assembly, Packaging Applications

MEMS Packaging

Posted by doEEEt Media Group
On March 12, 2020
0

Alter Technology UK, has experience in the assembly and packaging of MEMS devices. Our Labs offers customers support in both prototype/process development for LED packaging

Packaging and Assembly, Packaging Applications

Laser Diode Packaging

Posted by doEEEt Media Group
On March 12, 2020
0

Alter Technology UK, offers customers support in both prototype/process development for laser diode packaging as well as volume manufacturing capability.

Packaging and Assembly, Packaging Applications

Image Sensor Assembly

Posted by doEEEt Media Group
On March 12, 2020
0

Alter Technology (formerly Optocap), Image Sensor assembly platform is a flexible solution for CMOS, CCD and Focal Plane Array sensor chips into ceramic packages.

Packaging Applications

LED CHIP On Board

Posted by doEEEt Media Group
On March 12, 2020
0

Why LED Chip-on-Board? Cost-effective alternative to incandescent and fluorescent light sources Increased life span and efficiency System integration, no user-serviceable parts The reduced total cost of ownership Customised array size and shape Application-specific wavelengths

Packaging and Assembly, Packaging Applications

System In Package

Posted by doEEEt Media Group
On March 12, 2020
0

The semiconductor industry requires higher levels of integration, lower costs and greater functionality to meet the demands of consumer and industrial products.

Packaging and Assembly, Packaging Applications

Chip on Board

Posted by doEEEt Media Group
On March 12, 2020
0

Chip on Board assembly is the process whereby a bare semiconductor die is mounted on a printed circuit board or substrate using conductive or non-conductive epoxies.

Packaging and Assembly, Packaging Applications

QUANTUM

Posted by doEEEt Media Group
On March 12, 2020
0

Quantum technology applications such as atomic clocks, magnetometers and gravitometers are now emerging from the laboratory and confronting the challenging size, weight, power, cost and reliability demands of the real-world.

Packaging and Assembly, Packaging Applications

Photonic Integrated Circuit (PIC) Packaging

Posted by doEEEt Media Group
On March 11, 2020
0

A PIC is a photonic integrated circuit that integrates multiple photonic functions, such as lasers, detectors, modulators and splitters on a single chip.

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