Advantages of SAM for new space microelectronics inspection
- Posted by Javier Alejandro de la Ossa Fernández
- On March 10, 2022
- 0
SAM provides non-destructive imaging of defects and delamination in die and package materials. It is widely used to inspect microelectronics parts such as plastic encapsulated ICs, flip-chip systems, bonded wafers, printed circuit boards (PCBs), etc.
It is particularly useful for the inspection of small and complex devices. SAM is highly sensitive to defects that commonly originate under different stresses during manufacturing.
