Acoustic Inspection of Hybrid Systems on Laminated Substrates
- Posted by Francisco Javier Aparicio Rebollo
- On September 3, 2019
- 0
BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).