The Top Five Reasons Products Fail EMI Testing

Posted by doEEEt Media Group
On May 25, 2020
0

PC Board Design—Poor layout and layer stack-up Cable Shield Termination and Pigtails—Cable shields are not terminated to an enclosure or lack of common-mode filtering for unshielded products, plus shield pigtails used Gaps in the Return-Path—High-frequency clocks or signals crossing gaps in the return path Power Distribution Design—Poor power distribution network (PDN) design Shielding Design—Apertures or slots in the shielded enclosure that are too long

EEE Components, PASSIVES

UNIST Introduces Tiny Micro Supercapacitor On Chip, Ideal for Wearable Devices

Posted by doEEEt Media Group
On May 25, 2020
0

A tiny microsupercapacitor (MSC) that is as small as the width of a person’s fingerprint and can be integrated directly with an electronic chip has been developed. This has attracted major attention as a novel technology to lead the era of Internet of Things (IoT) since it can be driven independently when applied to individual electronic components.

EEE Components, PASSIVES

Technology Partnership on Ultracapacitor Technology

Posted by doEEEt Media Group
On May 25, 2020
0

Electrochem Solutions (“Electrochem”), an Integer Holdings Corporation (NYSE: ITGR) company, and Nanoramic Laboratories today announced the two companies have signed a technology licensing partnership that allows Electrochem to manufacture, sell and distribute Nanoramic’s FastCAP EE Series ultracapacitors worldwide.

EEE Components, PASSIVES

FastCAP Reflowable Chip Ultracapacitor for Power Backup

Posted by doEEEt Media Group
On May 25, 2020
0

FastCAP’s chip ultracapacitor is claiming to become the first reflowable, slim profile, and low ESR device that fits energy storage requirements for power back up and power loss protection in SSDs.

EEE Components, PASSIVES

FastCAP Ultracapacitor for Extreme Environment Applications

Posted by doEEEt Media Group
On May 25, 2020
0

FastCap has created a unique ultracapacitor utilizing carbon nanotubes and a unique electrolyte that extends the temperature range beyond other capacitors, allowing for use in extreme environments from -55 to +100degC and -40 to +150degC operation ranges.

ACTIVES, EEE Components, PASSIVES

High voltage DCM inverting charge pump converter

Posted by doEEEt Media Group
On May 24, 2020
0

A low-current, negative high-voltage is required to bias sensors in advanced driver assistance systems, ultrasonic transducers for sonar applications and communications equipment. Flyback, Cuk and inverting buck-boost converters are all possible solutions but are penalized by bulky transformers (flyback and Cuk) or limited in their maximum negative voltage by the controller’s input-voltage rating (inverting buck-boost).

ACTIVES, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, TESTING

Control Strategy, an accelerometer perspective

Posted by María Teresa Rodríguez
On May 21, 2020
0

An accelerometer is a sensor that measures acceleration. These sensors can be used in shock and vibration measurements.

The location of the control accelerometer is a key decision when vibration tests take place, as it can roughly affect the results in this kind of tests with small components. Commonly, the control accelerometer is placed in one...

ACTIVES, EEE Components, PASSIVES

Chip Varistors and Resisting Repeated Surges

Posted by doEEEt Media Group
On May 18, 2020
0

Chip varistors are used in many electronic devices as for surge protection and ESD measures as they are compact but show excellent surge absorption performance

EEE Components, PASSIVES

Best Ceramic Technologies for High Power Density Applications?

Posted by Kemet Electronic Corporation
On May 14, 2020
0

Capacitors are increasingly being recognized for having the potential to improve efficiency and power density. Read about ceramic technology guidelines for high power density circuits.

EEE Components, PASSIVES

Capacitors Can Help With ESD Too

Posted by doEEEt Media Group
On May 14, 2020
0

The data speed of the signals, traces, and ICs to be protected are something that must be carefully considered. In general, the faster the signal the less cap that can be safely placed on it.

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