Calculating the Best Power Inductor Solution

Posted by Kemet Electronic Corporation
On May 26, 2021
0

In a perfect world, Power Inductors for DC-DC Converters are required to be small, have high efficiency, as well as low cost. The challenge here is meeting all these requirements at the same time.

KEMET offers fully shielded Power Inductors with metal composite technology for standard applications, as well as AEC-Q200 certified components for automotive applications.

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EEE Components, PASSIVES

Reducing Losses with HVDC Power Film Capacitors

Posted by doEEEt Media Group
On May 26, 2021
0

Power capacitors with high-current capability that can withstand significant voltage fluctuations and surges help achieve stable voltage in HVDC systems over the long-distance transmission of electricity, as explained by TDK featured article.

EEE Components, PASSIVES

Wireless Power Transfer

Posted by Kemet Electronic Corporation
On May 26, 2021
0

Battery-driven vehicles need novel charging solutions. One ideal scenario for charging battery electric vehicles is to use wireless power transfer systems.

EEE Components, PASSIVES

Vishay Introduced New Powdered Iron Wireless Charging Coils

Posted by doEEEt Media Group
On May 26, 2021
0

New powdered iron-based, WPC-compliant (Wireless Power Consortium) wireless charging coils that offer direct replacements for devices for which end-of-life (EOL) was announced in 2017.

EEE Components, PASSIVES

EMC CL and LC Filters Comparison

Posted by doEEEt Media Group
On May 25, 2021
0

First, the insertion loss a general filter is defined, and then the impact of the source and load impedance on the insertion loss is investigated. Simulations and measurements focus on the CL and LC filters. In Part II (to appear in the next issue) the performance of the Pi and T filters is evaluated and compared to that of the CL and LC filters.

EEE Components, PASSIVES

Novel Conductive Polymer that Does Not Require Any Doping to Conduct Electricity

Posted by doEEEt Media Group
On May 25, 2021
0

In order to increase the conductivity of polymers, and in this way obtain higher efficiency in organic solar cells, light-emitting diodes and other bioelectronic applications, researchers have until now doped the material with various substances.

ACTIVES, EEE Components, PASSIVES

The European Commission Forms the Clean Hydrogen Alliance

Posted by doEEEt Media Group
On May 25, 2021
0

The Strategy sets out the key drivers of Europe’s industrial transformation and proposes a comprehensive set of future actions, including a Clean Hydrogen Alliance to accelerate the decarbonisation of industry and maintain industrial leadership.

EEE Components, PASSIVES

Why low ESR matters in capacitor design

Posted by Tomáš Zedníček
On May 24, 2021
0

A practical capacitor is a non-ideal component. Its circuit model contains series inductance (ESL) and series resistance (ESR). Although equivalent series resistance is often shown in circuit models as a constant value, it varies depending on operating conditions. ESR is resistance from a combination of energy loss mechanisms under specific operating conditions.

EEE Components, PASSIVES

Stackpole adds 3.5-W current-sense chip resistor

Posted by doEEEt Media Group
On May 23, 2021
0

Stackpole Electronics has expanded its CSRT family with the introduction of the high-power CSRT2512-UP current-sense chip resistor for applications that require high sensing precision and high power where the temperature coefficient of resistance (TCR) is more important than low resistance values.

EEE Components, PASSIVES

Compact EMI-Suppression and DC-Link Film Capacitors

Posted by Kemet Electronic Corporation
On May 19, 2021
0

KEMET’s new space-saving film capacitor’s designs, the C4AU DC-link power box and the R52 and R53 EMI X2 suppression capacitors are first-to-market solutions that meet the needs of today’s most challenging applications. Extensively tested for high reliability in harsh environments, the new KEMET’s miniaturized products offer an ultra-high capacitance in a compact package for more board savings and lower application costs for engineers.

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