Capacitance Package, Minimizing Footprint while Maximizing

Posted by Kemet Electronic Corporation
On April 17, 2020
0

KEMET KONNEKT™ package allows two to four ceramic capacitors to be stacked vertically or horizontally while retaining the integrity of the part. It uses transient liquid phase sintering (TLPS) technology to bond component terminations together. The KONNEKT™ U2J capacitors can be used in both orientations, thus minimizing the component footprint, while maximizing the bulk capacitance of a stacked MLCC with design flexibility in mind.

PASSIVES

Bypass capacitor S-parameter models: What you need to know

Posted by doEEEt Media Group
On April 9, 2020
0

Whether to think in the time domain or frequency domain, learn how to interpret capacitor manufacturer S-parameter models and how to apply them to your simulations.

EEE Components, PASSIVES

Modelling of Supercapacitor Charging Dynamics

Posted by doEEEt Media Group
On April 3, 2020
0

The charging behavior of the stack-electrode model presented here helps to understand the charging dynamics of porous electrodes and qualitatively agrees with experimental time scales measured with porous electrodes.

EEE Components, PASSIVES

Influence of a Common Mode Choke to the Noise on the Data Line Explained

Posted by doEEEt Media Group
On March 27, 2020
0

Lorandt shows how a CMC is able to reduce the noise on a real application using the EMC noisy box.

EEE Components, PASSIVES

Effect of Resistor TCR Tracking to Analog and A/D Signal Processing

Posted by doEEEt Media Group
On March 27, 2020
0

Digital A/D Conversion Digitization converts a continuous signal into one that has discrete values represented with bits.

ABC of CLR

Mounting Guidelines: Common Soldering Process Issues

Posted by doEEEt Media Group
On March 27, 2020
0

Fast oxidisation is a common issue related to high temperatures and the presence of oxygen during the convection reflow or wave soldering processes. The oxidisation may induce some degradation of metal surface and its environmental robustness, thus impacting the components and the electronic hardware lifetime.

ACTIVES, EEE Components

Varistors Structure, Function and Design

Posted by doEEEt Media Group
On March 26, 2020
0

Just as thermistors the varistor is fabricated from a compressed and sintered powder compound that consists of silicon carbide (SiC) or zinc oxide (ZnO). The ZnO varistor has superior characteristics and predominates today all manufacture. This section deals with ZnO varistors only.

EEE Components, PASSIVES

Glass-sealed lids can miniaturize and improve reliability

Posted by doEEEt Media Group
On March 26, 2020
0

Glass-sealed lids can miniaturize and improve the reliability of supercapacitors and electrolytic capacitors. Capacitors are more a part of our daily lives than we may think.

EEE Components, PASSIVES

Negative capacitor enable higher voltage

Posted by doEEEt Media Group
On March 26, 2020
0

Researchers have created a permanent static ‘negative capacitor,’ a device believed to have been in violation of physical laws until about a decade ago. The newly devised static negative capacitor could improve computing and yield more energy-efficient computers.

EEE Components, PASSIVES

Vishay Automotive Inductor Offers Operating Temperature to +155 °C

Posted by doEEEt Media Group
On March 26, 2020
0

The AEC-Q200 qualified device released today is optimized for energy storage in DC/DC converters up to 2 MHz. It also provides excellent attenuation of noise in high current filtering applications up to the SRF of the inductor.

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