ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION, Plastic Packaging for Space

Are there Voids in your IC Plastic Molding?

Posted by Raquel Cano Cordero
On November 10, 2021
0

Voids are defined as a lack of material within the bulk of the moulding compound and are common in ICs since they appear during improper molding manufacturing (injection, extrusion, etc.) and curation.

ACTIVES, C-SAM - Short Technical Notes, EEE Components, TESTING

Thermo-mechanical Analyser – TMA – capabilities

Posted by Raquel Cano Cordero
On October 5, 2021
0

The thermomechanical analysis (TMA) of plastic encapsulated microelectronic and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices.

ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Thermo-Mechanical Analysis

Posted by Raquel Cano Cordero
On August 9, 2021
0

The thermomechanical analysis (TMA) of plastic encapsulated microelectronic, and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices.

ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION

Importance of the SAM for delamination detection

Posted by Raquel Cano Cordero
On July 13, 2021
0

SAM for delamination detection. Scanning Acoustic Microscopy is a technique that has revealed as the most effective and complete non-destructive approach for the detection of critical and latent anomalies within plastic encapsulated parts

C-SAM - Short Technical Notes, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, TESTING

Non-Destructive Detection of Delaminations in PCBs Assemblies

Posted by Raquel Cano Cordero
On March 10, 2021
0

Scanning Acoustic Microscopy (C-SAM) inspection has been used for the comprehensive inspection of the lead-frame in a horizontally stacked capacitor. This non-destructive inspection reveals minor anomalies at the interface with capacitor terminals which may impair the electrical response.