ACTIVES, COTS, New Space, LEO Constellations, EEE Components

Renesas-INTERSIL: Radiation Tolerant Plastic Products

Posted by Manuel Padial Pérez
On November 25, 2020
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The family of products ISL71xxx radiation-tolerant plastic-package ICs enable cost effective solutions for short duration low Earth orbit (LEO) mission profiles.

ACTIVES, COTS, New Space, LEO Constellations, EEE Components

ANALOG DEVICES: Commercial Space (CS) Products

Posted by Manuel Padial Pérez
On November 25, 2020
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Analog Devices has established three commercial space product screening and qualification flows to address New Space needs, designed to offer the best price/reliability ratio for applications targetting different requirements

ACTIVES, COTS, New Space, LEO Constellations, EEE Components

TEXAS INSTRUMENTS: Space Enhanced products (SEP)

Posted by Manuel Padial Pérez
On November 25, 2020
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Space Enhanced Plastic Products (SEP) devices developed to address, among others, New Space applications, offer the following advantages over standard catalog products

ACTIVES, ALTER Laboratory Services, EEE Components, PASSIVES, RF & MW, TESTING

Steps to Procurement of Electronic Components

Posted by Manuel Padial Pérez
On November 20, 2020
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Satellites with ESA as end customer and a prime contractor. This is a procurement approach where the agent receives the purchase orders for parts from various parts users, extracts and compiles the total need quantities per type and manufacturer, along with the necessary attrition (including DPA, LAT or QCI and radiation samples) and places the purchase orders at the corresponding manufacturers. Upon receipt of the flight parts by the CPPA, the ordered parts quantities will be tested as required and shipped to the individual users. The main features of the co-ordinated procurement are:

ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

How and Why to Test for Displacement Damage

Posted by Manuel Padial Pérez
On November 16, 2020
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Displacement Damage is the result of nuclear interactions, typically scattering, which cause lattice defects. Displacement damage degrades minority carrier lifetime; a typical effect would be the degradation of gain and leakage current in bipolar transistors.

ACTIVES, EEE Components

ST MICROELECTRONICS Rad-Hard Point-of-Load RHRPMPOL01 for Space Applications

Posted by Manuel Padial Pérez
On November 16, 2020
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The STMICROELECTRONICS RHRPMPOL01 is a 7 A monolithic synchronous step-down regulator with a high-precision internal voltage reference and integrated power MOSFETs for synchronous conversion.

ACTIVES, COTS, New Space, LEO Constellations, EEE Components

RAKON: High Reliability Radiation Tolerant COTS

Posted by Manuel Padial Pérez
On August 15, 2020
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XOs RK105 and VCXOs RK205 products specifically designed for New Space applications, have the following characteristics

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MIL-STD-883 METHOD 2003 – Solderability Testing

Posted by Manuel Padial Pérez
On July 23, 2020
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The Mil-Std-883 Method 2003 Is One Of The Oldest And Most Widely Used Standards For Solderability Testing.

EEE Components, MANUFACTURER NOTIFICATION, PASSIVES

Glass Encapsulated Beads ESCC 4006/014 Type NTC Thermistors

Posted by Manuel Padial Pérez
On July 12, 2020
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In this post are addressed two product change notifications (PCN) affecting to 4006/014 type variants. Changes which have been discussed and agreed with ESA without any effect on the qualification status of ESCC qualified devices

ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Failure Analysis in Electronic Components

Posted by Manuel Padial Pérez
On April 21, 2020
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Failure analysis is the process of analysing the component data or the component itself to determine the reason(s) for degraded performance or catastrophic failure of a component either, during component manufacturing and testing, during incoming inspection, or after delivery to the customer, at the final application. Since there is an infinite number of variables in play at any one time, it is important as the first step in any failure analysis to understand how and when the failure occurred.

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