PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why Microsectioning sample preparation of PCB systems?

Posted by Mari Carmen López
On May 19, 2021
0

Microsectioning sample preparation is an essential tool for the detailed materialographic inspection of EEE parts, including solder joints on PCB systems involving both surface mounting technology (SMT) and through hole technology (THT). In reveals critical information regarding the structural characteristics and the workmanship quality that is not accessible by other techniques.

EEE Components, ENDURANCE, ENVIRONMENTAL & RADIATION, Microsectioning - Short Technical Notes

Inspection of conformal coating on PCB using UV Light

Posted by Mari Carmen López
On August 4, 2020
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The aim of the external inspection of coated PCA is to determine if all the surfaces and devices are adequately covered. In order to make easy such inspection, fluorescing agents can be added to the polymeric formulation, which shows a blue glow when the PCA is exposed to ultraviolet (UV) light.

Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Plating Thickness Testing Overview in Alter Technology Lab.

Posted by Mari Carmen López
On July 28, 2020
0

Cross-sectioned ceramic capacitors were metallographically prepared in the Materials & Processes Laboratory, recognized as a recommended facility for such activity by the ESA authority (MEMO ESA-TECMSP-MO-013165).

Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Evaluation of PCB in Alter Technology Lab.

Posted by Mari Carmen López
On July 25, 2020
0

The separation of the interest area has to be performed in such a way as to prevent any damage by deformation or input of heat. After cleaning, the specimen is encapsulated before the grinding process takes place.

Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Evaluation of Electronic Assemblies

Posted by Mari Carmen López
On July 18, 2020
0

Assembly process of THT or SMT onto PCBs for spacecraft applications follow well-established design requirements based on specifications prepared by ECSS (ECSS-Q-ST-70-08C & ECSS-Q-ST-70-38C), NASA and IPC (IPC-6012).

Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY

Failure Analysis in Microsection Inspection

Posted by Mari Carmen López
On July 10, 2020
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Microsection analysis is performed on an assembled through hole device as a part of a failure analysis. Cross-section through the plane of interest can provide helpfully information about solder defects, PCB inner layers and internal construction. As a part of a failure analysis, the plane of interest has to be selected taking into account PCB characteristic, observed failure and previous test results.

EEE Components, Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Microsectioning inspection of assembled capacitors

Posted by Mari Carmen López
On May 9, 2020
0

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Doing Failure Analysis in EEE Parts

Posted by Mari Carmen López
On March 29, 2020
0

Failure analysis is the process of analysing the component data or the component itself to determine the reason(s) for degraded performance or catastrophic failure of a component either, during component manufacturing and testing, during incoming inspection, or after delivery to the customer, at the final application. Since there are an infinite number of variables in play at any one time, it is important as a first step in any failure analysis to understand how and when the failure occurred.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Studying Critical elements in PCB systems: Plated Through Via (PTV)

Posted by Mari Carmen López
On March 13, 2020
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Plated Through Vias (PTV) are critical elements in PCB systems and special care must be paid during their inspection in order to ensure the reliability, as they are one the main factors that determine the PCB Quality. The functionality and reliability of PTVs are dictated by: the plated through hole architecture (height/diameter), plating (thickness and quality) and other PCB general characteristics (materials and design).

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Plated Through Via (PTV) Manufacturing Defects

Posted by Mari Carmen López
On March 13, 2020
0

The performance of PCB systems are sensitive to variations in the plating thickness of its vias, depends on the current/time in the copper plating bath and the throwing power. Insufficient plating thickness reduces the mechanical and thermal properties of the board and may lead to fatigue or overstress cracking, such us corner cracking and barrel cracking described below.

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