INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Radiographic Inspection 3D X-Ray – 2D

Posted by José Cándido Vázquez Cárdeno
On September 14, 2020
0

The purpose of radiographic inspection is to detect internal physical defects which are not otherwise visible in electronic components. The radiographic techniques reveal such flaws as the presence of foreign objects, improper interconnecting wires, inhomogeneities in materials, improper positioning of elements, voids in the die attach material or encapsulating, etc.

ALTER Projects

SOLAR CELLS

Posted by José Cándido Vázquez Cárdeno
On February 24, 2020
2

Solar panels are required to have more output power and less weight and volume, namely, higher specific power and lower storage volume. To meet these requirements, the simultaneous achievement of both efficiency improvement and weight reduction for solar cells is necessary.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

DC power – Use of Substrate Attach Strength – Die Shear Strength Method

Posted by José Cándido Vázquez Cárdeno
On February 13, 2019
0

The purpose of the test is to determine the strength of the element attachment system when subjected to force in the Y1 axis, and thus to determine the integrity of materials and processes used to attach semiconductor die or surface mounted elements to package headers or other substrates. The implementation of this test includes material evaluation and process control.