INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Understanding the use of Thermoreflectance Thermal Imaging

Posted by Francisco Javier Aparicio Rebollo
On October 11, 2020
0

Submicrometric-nanometric objects nowadays present in the design of integrated circuits induce singular heat transport phenomena leading to the formation of hot-spots or strong temperature gradients at specific focal points, which compromises the suitable operation and reliability of microelectronic systems and can potentially decrease the lifetime.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why Crimped Connector Mechanics Failure?

Posted by Francisco Javier Aparicio Rebollo
On September 21, 2020
0

Crimped connectors are extensively present in EEE systems because of the good performance and easier installation at reduced dimension. Due to the key role played, they are required to have high durability even under harsh operating conditions. In the case of unexpected/early failure, thorough diagnosis and deep understanding of the main failure causes are the starting point to preclude future occurrence and improve the system reliability.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM: Test flow and procedures

Posted by Francisco Javier Aparicio Rebollo
On September 17, 2020
0

Nowadays scanning acoustic microscopy (SAM) is extensively used in the non-destructive inspection of microelectronic devices and is present in different space verification programs; particularly for plastic-encapsulated electronic components. This is so due to the ability to image the internal morphology, location, size and distribution of hidden features including different types of flaws.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Which are the improper degrees of Crimped Connectors?

Posted by Francisco Javier Aparicio Rebollo
On August 21, 2020
0

Stress relaxation: decrease of the contact pressure held between the wires and at the wire-barrel interface, Improper crimping: neither damage the insulation of the wire strands nor to leave insulator residues over the stripped conductor. Diagnosis tools: improper degree of compression and related issues can be detected either

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

C-SAM Questions & Answers

Posted by Francisco Javier Aparicio Rebollo
On July 7, 2020
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In this post, you can read all the questions launched by the attendees, as well as all the answers offered by the speaker.

C-SAM - Short Technical Notes, COTS components

How to protect your COTS parts during C-SAM inspections

Posted by Francisco Javier Aparicio Rebollo
On July 7, 2020
0

The current post describes the different measures taken during Scanning Acoustic Microscopy (SAM) inspection to avoid potentially harmful effects associated with water immersion. Internal visual inspection conducted after decapsulation shows the successful prevention of corrosion phenomena in these samples.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Non-destructive internal inspection of EEE parts and passive components

Posted by Francisco Javier Aparicio Rebollo
On July 7, 2020
0

Non-destructive testing methods are critical for the screening, inspection and failure analysis of plastic encapsulated and other EEE systems.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM Test methods: comparisons

Posted by Francisco Javier Aparicio Rebollo
On June 17, 2020
0

Additional testing: This deviation is considered as a reliability concern and additional tests must be conducted to check the system performance. From the point of view of the SAM inspection, such deviations do not comply with the acceptance criterion

C-SAM - Short Technical Notes, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, TESTING

Scanning Acoustic Microscopy (C-SAM) of in Stacked Capacitors

Posted by Francisco Javier Aparicio Rebollo
On June 12, 2020
0

Scanning Acoustic Microscopy (C-SAM) inspection has been used for the comprehensive inspection of the lead-frame in a horizontally stacked capacitor. This non-destructive inspection reveals minor anomalies at the interface with capacitor terminals which may impair the electrical response.

C-SAM - Short Technical Notes, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Ultrasonic Examination of Ceramic Capacitors by Scanning Acoustic Microscopy

Posted by Francisco Javier Aparicio Rebollo
On May 18, 2020
0

Ultrasonic Examination of Ceramic Capacitors by Scanning Acoustic Microscopy (SAM) has proved to be the most effective tool for the non-destructive detection of very thin (even below 200 nm of thickness) internal anomalies (delamination, voids, cracks, and foreign material) within ceramic capacitors and other EEE parts

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