Packaging and Assembly, Plastic Packaging for Space

Photonic Packaging

Posted by doEEEt Media Group
On March 12, 2020
0

Optoelectronic or Photonics packaging requires extremely accurate placement of components to ensure appropriate suitable alignment and coupling of light into and out of devices.

Packaging and Assembly, Packaging Applications

Laser Diode Packaging

Posted by doEEEt Media Group
On March 12, 2020
0

Alter Technology UK, offers customers support in both prototype/process development for laser diode packaging as well as volume manufacturing capability.

Packaging and Assembly, Plastic Packaging for Space

Fast-turn IC Assembly

Posted by doEEEt Media Group
On March 12, 2020
0

Alter Technology (formerly Optocap), also offer fast-turn IC assembly services into a wide range of ceramic and open-cavity plastic packages including; CERDIP, CERQUAD, CLCC, CDIP, PGA, TO-Header QFN, SOIC, QFP, TSOP, SOP, PLCC, PDIP, BGA

Packaging and Assembly, Packaging Applications

Image Sensor Assembly

Posted by doEEEt Media Group
On March 12, 2020
0

Alter Technology (formerly Optocap), Image Sensor assembly platform is a flexible solution for CMOS, CCD and Focal Plane Array sensor chips into ceramic packages.

Packaging Applications

LED CHIP On Board

Posted by doEEEt Media Group
On March 12, 2020
0

Why LED Chip-on-Board? Cost-effective alternative to incandescent and fluorescent light sources Increased life span and efficiency System integration, no user-serviceable parts The reduced total cost of ownership Customised array size and shape Application-specific wavelengths

Packaging and Assembly, Packaging Applications

System In Package

Posted by doEEEt Media Group
On March 12, 2020
0

The semiconductor industry requires higher levels of integration, lower costs and greater functionality to meet the demands of consumer and industrial products.

Packaging and Assembly, Packaging Applications

Chip on Board

Posted by doEEEt Media Group
On March 12, 2020
0

Chip on Board assembly is the process whereby a bare semiconductor die is mounted on a printed circuit board or substrate using conductive or non-conductive epoxies.

Alter Technology Products, Packaging Design

FRONT PANEL TL-FP-3421

Posted by doEEEt Media Group
On March 12, 2020
0

ALTER TL-FP3421 provides an efficient way to control and monitor the current status of a 19” Galileo COTS-based system with three LEDs, and one more LED indicates if the system is power supplied or not.

Packaging and Assembly, Packaging Applications

QUANTUM

Posted by doEEEt Media Group
On March 12, 2020
0

Quantum technology applications such as atomic clocks, magnetometers and gravitometers are now emerging from the laboratory and confronting the challenging size, weight, power, cost and reliability demands of the real-world.

Alter Technology Products, Packaging Design

REMOTE: External Cavity Diode Laser

Posted by doEEEt Media Group
On March 12, 2020
0

For Quantum Technologies to fulfil their potential requires orders of magnitude reduction in size, weight, power-consumption and cost (SWaP-C) compared to many of the current generation of laboratory demonstrators. In addition, the instrument must be reliable in real-world environments where it will be exposed to vibrations, shocks and temperature changes during operation.

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