Assembly Processes, Packaging and Assembly

Stud Bumping

Posted by doEEEt Media Group
On March 16, 2020
0

Gold stud bumping forms Au bumps using a process very similar to Au ball wire bonding. Like wire bonding it forms an Au ball (stud). However, the wire is terminated after the first bond so there is only a bump on the die.

Assembly Processes, Packaging and Assembly

Wire Bonding Services

Posted by doEEEt Media Group
On March 16, 2020
0

Alter Technology UK, works closely with our customers at the package design stage to ensure that design for manufacturing techniques are applied and wire bond design rules, where possible, are adhered to. This co-design activity is crucial in the development of a high-yield, fully automated, and fully optimized wire bond process.

Assembly Processes, Packaging and Assembly

Die Bonding Services

Posted by doEEEt Media Group
On March 16, 2020
0

Die bonding is the process of attaching a die to substrate/package. Selection of the optimal die attaches material and process is based on a number of issues including thermal requirements, electrical requirements and mechanical stability.

ALTER Laboratory Services, ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

RadLab: Radiation Testing Services on Electronics Parts

Posted by doEEEt Media Group
On March 14, 2020
0

Radiation Testing Services – RADLAB Radiation testing (ionizing and nonionizing) effect is one of the main factors affecting the reliability of equipment and systems operating in space. However, there is also a growing interest in it in other technological fields such as avionics, high energy physics, the automotive industry, nuclear industry, etc.

Assembly Processes, Packaging and Assembly

Pick and Place

Posted by doEEEt Media Group
On March 13, 2020
0

Alter Technology UK, has the capability to pick and place die from a variety of presentation formats with placement accuracies ranging from 1um to 15um.

Assembly Processes, Packaging and Assembly

Wafer Sawing

Posted by doEEEt Media Group
On March 13, 2020
0

Wafer Sawing is the process of singulating the wafer into individual dies ready for subsequent assembly. Alter Technology UK has the capability for Wafer saw of substrates up to 8” diameter. When dicing of substrates of 12” diameter is required then ATN UK can process 12” substrates into smaller segments prior to dicing.

Assembly Processes, Packaging and Assembly

Optical Alignment

Posted by doEEEt Media Group
On March 13, 2020
0

Alter Technology UK, has extensive experience in aligning and attaching fibers and optical components to a wide range of optoelectronic devices, including DFB lasers, Quantum Cascade lasers, SLEDs, SOA and Receivers.

Packaging and Assembly, Plastic Packaging for Space

Space and HI-REL Assembly

Posted by doEEEt Media Group
On March 12, 2020
0

Alter Technology (formerly Optocap), is a leader in the design, manufacture and test of High Reliability Micro and Optoelectronics modules for Harsh Environments. We have experience in a number of high reliability and harsh environment markets such as Aerospace & Defence, Space, Oil & Gas

Packaging and Assembly, Packaging Applications

MEMS Packaging

Posted by doEEEt Media Group
On March 12, 2020
0

Alter Technology UK, has experience in the assembly and packaging of MEMS devices. Our Labs offers customers support in both prototype/process development for LED packaging

RF Testing

RF and Microwave

Posted by doEEEt Media Group
On March 12, 2020
0

As RF modules run at very high frequencies the effects of capacitance and stray inductance become even more important. The RF module must be designed and assembled with an understanding of these effects.

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