Würth Elektronik Releases 2020 Custom Capabilities Catalog
- Posted by doEEEt Media Group
- On March 17, 2020
- 0
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TDK publishes new Data Book for aluminum electrolytic capacitors
- Posted by doEEEt Media Group
- On March 17, 2020
- 0
TDK Corporation presents the fully revised Data Book for aluminum electrolytic capacitors with screw terminal, snap-in, axial and single-ended design.
How to Suppress Triacs EMI and RFI Noise
- Posted by doEEEt Media Group
- On March 16, 2020
- 0
Noise is generated in all semiconductor devices including triacs. Triacs are used in such power-switching applications as inverter- or motor-control circuits. Triacs and thyristors (silicon-controlled rectifiers, or SCRs) are used in power-switching applications because these can handle high voltages and currents.
Vishay extended its TNPU e3 series
- Posted by doEEEt Media Group
- On March 16, 2020
- 0
Vishay Intertechnology, Inc. announced that the company has extended its TNPU e3 series of automotive-grade ultra-precision thin film flat chip resistors with a new space-saving component in the compact 0402 case size.
Yageo is releasing 2020 product selection guide
- Posted by doEEEt Media Group
- On March 16, 2020
- 0
Yageo has released its 2020 online product selection guide catalogue of their chip resistors, surface mount MLCCs and wireless components.
Würth Elektronik extends its MagI³C Power Module with 36 V versions
- Posted by doEEEt Media Group
- On March 16, 2020
- 0
The FDSM series of MagI³C power modules are fully integrated DC/DC voltage converters with fixed output voltage. The modules comprise the power stage, controller, inductors, and effective operational input and output capacitors. They also come with thermal overload and short circuit protection.
Yageo releases versatile low profile metal chip resistor current sensor
- Posted by doEEEt Media Group
- On March 16, 2020
- 0
Yageo Corporation, the global electronic component leader, recently announced to release the new low profile metal current sensor chip resistor, the PA low profile series. It is a perfect solution where ultra thin packaging is required for miniaturization applications.
Package Design and Modelling
- Posted by doEEEt Media Group
- On March 16, 2020
- 0
Alter Technology UK, mechanical design experience covers custom hermetic packages, precision optical benches, heat spreaders, sub-mounts, high power laser coupling.
Optical design
- Posted by doEEEt Media Group
- On March 16, 2020
- 0
Alter Technology UK, optical design capabilities are rooted within the laser and photonics industries for EEE components
Encapsulation and Hermetic sealing
- Posted by doEEEt Media Group
- On March 16, 2020
- 0
Encapsulation is the process to protect die from damage after die attach and wire bond. There are two main types of encapsulation: Glob Top and Dam and Fill.