Pros and Cons of MLCC Downsizing

Posted by doEEEt Media Group
On January 25, 2021
0

Advantages and disadvantages of MLCC downsizing are discussed in AVX technical papers written by Frank Hodgkinson and Maureen Strawhorne. As integrated circuits (ICs) continue to pack more functionality into smaller packages, the need for bulk off-chip capacitance remains. In resonant circuits, such as phase-lock-loops (PLLs) and switching regulators, precision class one ceramic capacitor may be required.

EEE Components, PASSIVES

Reliability Issues with Polymer and MnO2 Tantalum Capacitors

Posted by doEEEt Media Group
On January 25, 2021
0

A comparative analysis of degradation processes, failure modes and mechanisms in MnO2 and polymer technology tantalum capacitors. Analyzed conditions include effects of vacuum and radiation, soldering (pop-corning), long-term storage, operation at high temperatures, stability at low and high temperatures, and anomalous transients.

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Digi-Key Electronics – Capacitors Shortages comments

Posted by doEEEt Media Group
On January 25, 2021
0

The capacitor industry experiences shortages for a variety of reasons. To start, capacitors are widely used in various end markets with high output. The automobile and consumer industries are just two examples where sometimes thousands of capacitors are needed to build a single product.

EEE Components, PASSIVES

Würth Elektronik Published New Catalog of AEC-Q200

Posted by doEEEt Media Group
On January 25, 2021
0

Würth Elektronik has published a new catalog of AEC-Q200 certified components for automotive electronics. Product highlights include new ferrites, inductors and particularly robust electromechanical components.

EEE Components, PASSIVES

Highest Transmission Data Rate on Long Cable Intel SHDSL Evaluation Kit

Posted by doEEEt Media Group
On January 20, 2021
0

The evaluation board included in the kit can be used as an EFM modem, SHDSL EFM module or plug & play Ethernet extender. It has a selectable bit rate including auto mode and USB-EIA232 emulation or TTL compatible EIA232 interface.

EEE Components, PASSIVES

High Saturation, High Tempature Through-Hole Inductor in Compact Size

Posted by doEEEt Media Group
On January 20, 2021
0

Vishay Intertechnology introduces a new through-hole inductor that delivers a 420 A saturation current for 30 % inductance reduction in a compact 1500 case size. For renewable energy, industrial, and telecom applications, the Vishay Dale IHXL-1500VZ-51 offers very low typical DCR down to 0.12 mΩ and continuous high-temperature operation to +155 °C.

EEE Components, PASSIVES

Embedded Components in Printed Circuit Boards Explained

Posted by doEEEt Media Group
On January 20, 2021
0

Würth Elektronik Webinar

Miniaturisation? Integration of functions? Increased reliability? IP protection? All this is possible by embedding components into the printed circuit board.

The technology for this is called Embedding Technology (ET) and is characterized by different variants that can be used depending on the type of components. This creates completely new...

EEE Components, PASSIVES

High Voltage MLCCs for Battery Electric Vehicles

Posted by doEEEt Media Group
On January 20, 2021
0

There is a measurable correlation between the rate at which nations attempt to achieve carbon emissions goals and the rate at which they develop electric vehicles. Many of these emissions goals have been set for the year 2025, which means that a significant boost in the demand for components that enable such reductions is well underway.

EEE Components, PASSIVES

Applications and Fundamentals of SuperCapacitors

Posted by doEEEt Media Group
On January 18, 2021
0

Veronica Augustyn from NC State University describes in-depth details about Supercapacitors (Electrochemical Capacitors) structure and basic physical mechanisms at Chemical Science Roundtable

Source: NC State University, Chemical Sciences Roundtable

ACTIVES, EEE Components

Smoltek is Awarder by New Patent on Compact Energy Storage Interposer

Posted by doEEEt Media Group
On January 18, 2021
0

Smoltek’s inventions facilitate such integration of extremely low-profile solid state energy storage devices such as CNF-MIM capacitors, closer to the connection points and power rails of the active chips.

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