Thermal Conductivity and Stability

Posted by doEEEt Media Group
On November 16, 2021
0

High thermal conductivity plastics filled with graphene have high thermal conductivity and good thermal stability, and their development prospects are very broad. Besides the thermal conductivity, graphene has other excellent properties, such as high strength, high electrical and optical properties, and is widely used in mobile devices, aerospace, and new energy batteries.

EEE Components, PASSIVES

Replacing Ceramic Capacitors

Posted by doEEEt Media Group
On November 16, 2021
0

What Parameters to Check?

Prof. Sam Ben-Yaakov published a video with an overview and detailed description of parameters to be checked and considered when replacing the ceramic capacitor

Source: Sam Ben-Yaakov

ACTIVES, EEE Components

Purity of Materials May be the Key in Further Memristor Development

Posted by doEEEt Media Group
On November 12, 2021
0

Memristors are considered a highly promising alternative to conventional nanoelectronic elements in computer Chips. Because of the advantageous functionalities, their development is being eagerly pursued by many companies and research institutions around the world.

EEE Components, PASSIVES

RF Inductors and Filters – LTCC

Posted by doEEEt Media Group
On November 10, 2021
0

LTCC can be used to produce multi-layer modules in which cavities, Rs, Ls and Cs are integrated. Good thermal conductivity and a low TCE (Temperature Coefficient of Expansion) are achieved.

ACTIVES, EEE Components, PASSIVES

Integrated Passives on the Innovation Growth Curve

Posted by doEEEt Media Group
On November 6, 2021
0

Few designs have sufficient volume and sensitivity to circuit size to warrant the shift to integrated passives. It often make sense to trade the PCB space and circuit tolerances against setup costs. As a result, it is no surprise that the market size for integrated passives is dwarfed by that of discretes. Even though they are making inroads, the relative growth of integrated passives is only slightly faster than that of the main market.

EEE Components, PASSIVES

Nano Dimension Presents Production-Grade Printed Capacitors for PCBs

Posted by doEEEt Media Group
On November 6, 2021
0

Nano Dimension Ltd., a leading additive electronics provider for electronics, announced that it has developed 3D printed capacitors with the Company’s pioneering DragonFly additive manufacturing system. These capacitors are embedded in the body of the additively manufactured printed circuit boards (PCBs), saving space and eliminating the need for assembly.

EEE Components, PASSIVES

Temperature/DC Bias MLCC Models for SPICE Simulations

Posted by doEEEt Media Group
On November 5, 2021
0

Taiyo Yuden provides various component libraries for microwave circuits, PI, and SI simulators. The recent release add long-time wished temperature/DC Bias Models on MLCC capacitors for HSPICE and Spectre simulations.

EEE Components, PASSIVES

TDK Developed Miniature Thin-Film Power Inductors

Posted by doEEEt Media Group
On November 5, 2021
0

TDK Corporation has developed a series of thin-film metal power inductors for automotive power circuits. The new TFM201210ALMA inductors feature a mounting area downsized approximately 22 % from TDK’s conventional product, TFM201610ALMA (2.0 mm (L) x 1.6 mm (W) x 1.0 mm (H)).

EEE Components, PASSIVES, RF & MW

How to Use a Ferrite Bead to Reduce EMI

Posted by doEEEt Media Group
On November 5, 2021
0

Ferrite beads protect PCB from EMI, by attenuating a specific band of high frequencies, or acting as an LC filter when combined with a capacitor, or separating ground and power planes.

EEE Components, PASSIVES

New Chip Inductor Series Offering High Q in Miniature Size

Posted by doEEEt Media Group
On November 5, 2021
0

Bourns' new Model CWF1610 and CWF2414 chip inductors feature wire-wound construction to unlock enhanced performance characteristics for RF signal processing and DC power line applications.

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