Offering end-to-end backend semiconductor manufacturing, from wafer singulation...
Services & Capabilities
Encapsulation is the process to protect die from damage after die attach and wir...
Alter Technology UK, works closely with our customers at the package design stag...
Die bonding is the process of attaching a die to substrate/package. Selection of...
Alter Technology UK, has extensive experience in aligning and attaching fibers a...