Flip chip (also known as direct chip attach) is the process whereby a semiconduc...
Services & Capabilities
MEMS Packaging
doEEEt Media Group
Alter Technology UK, has experience in the assembly and packaging of MEMS device...
Laser Diode Packaging
doEEEt Media Group
Alter Technology UK, offers customers support in both prototype/process developm...
Image Sensor Assembly
doEEEt Media Group
Alter Technology (formerly Optocap), Image Sensor assembly platform is a flexibl...
LED CHIP On Board
doEEEt Media Group
Why LED Chip-on-Board? Cost-effective alternative to incandescent and fluores...
System In Package
doEEEt Media Group
The semiconductor industry requires higher levels of integration, lower costs an...
Chip on Board
doEEEt Media Group
Chip on Board assembly is the process whereby a bare semiconductor die is mounte...
Photonic Integrated Circuit (PIC) Packaging
doEEEt Media Group
A PIC is a photonic integrated circuit that integrates multiple photonic functio...