APPLICATIONS

for Electronic Components

Services & Capabilities

Flip Chip

doEEEt Media Group
FLIP-CHIP
Flip chip (also known as direct chip attach) is the process whereby a semiconduc...

MEMS Packaging

doEEEt Media Group
MEMS
Alter Technology UK, has experience in the assembly and packaging of MEMS device...

Chip on Board

doEEEt Media Group
LED-array
Chip on Board assembly is the process whereby a bare semiconductor die is mounte...

QUANTUM

doEEEt Media Group
Quantum-
Quantum technology applications such as atomic clocks, magnetometers and gravito...
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