HEATPACK: Higher thermal dissipation in space systems

Reducing the size and increasing power capabilities of electronic devices is of major importance for the overall performance of any satellite. Higher-strength of the signals for Navigation applications and higher throughput in telecommunication satellites are pushing towards higher power density at payload subsystems. Currently, there is a large maturity gap between GaN or Silicon Carbide components and thermal management solutions at assembly or package level. Most of the available packaging solutions are from Japan or the US only, and not necessarily suitable for space applications in terms of reliability and/or performance.

HEATPACK (High thErmAl efficiency componenTs PACKages for space) is the European effort to develop the next generation of low thermal resistance packages, in particular thanks to the implementation of state-of-the-art diamond-based composite materials and disruptive new heat sink solutions. In order to secure a supply chain for packages and ensure the non‐dependence and competitiveness at the European level, 9 partners from 7 different countries collaborate in the frame of HEATPACK. Space level reliability of the developed solutions, as well as their commercial viability, will be demonstrated within the frame of the project.