3rd PCNS Call for Papers

PCNS Passive Components Networking Symposium is a bi-annual international symposium organized by EPCI European Passive Components Institute in co-operation with a European university. 3^rd edition of the PCNS Passive Components Networking Days Symposium is hosted by Department of Chemistry, Materials and Chemical Engineering “Giulio Natta” and Department of Electronics, Information Bioengineering Faculty of Politecnico di Milano.

3rd PCNS is intended as a hybrid, live event with speakers present and streaming options for virtual attendees.

“Being virtually tired, September may be a good time to finally meet face to face again and discuss in live mode what is going on in the world of passive electronic components. In the worst-case scenario, the PCNS would turn into a virtual event, that we are ready for. Still, we hope for the best to welcome both live and virtual attendees,” said Tomas Zednicek, EPCI and PCNS organizing committee president.

PCNS mission is to promote the discussion of recent developments and trends in passive electronic components and encourage the exchange of technical expertise and information covering a broad range of EEE passive components.

The theme will be mainly elaborated in conference Workshop, Hot Topic Panel Discussion and Keynotes selection preferences.

Abstract of papers related to passive electronic components are welcomed for online submission at the conference website by 2^nd April 2021. The abstracts will be then evaluated by Technical Programme Committee (TPC) experts representing passive component manufacturers, universities and space agencies.

TOPICS

• MATERIALS & PROCESSES
• DESIGN & CONSTRUCTION
• MEASUREMENT & TEST
• QUALITY & RELIABILITY
• TECHNOLOGY & ROADMAPS
• APPLICATIONS
• NEW DEVELOPMENT
• MODELLING & SIMULATION

COMPONENTS

• CAPACITORS
• INDUCTORS & TRANSFORMERS
• RESISTORS
• FUSES
• FILTERS
• RF PASSIVES
• PASSIVE SENSORS
• CONNECTORS & CABLES
• CRYSTALS & OSCILLATORS

The past 2^nd PCNS 2019 hosted by Politehnica University of Bucharest, Romania was attended by 63 participants from 13 European countries, USA and China as networking event of designers, purchasers, application engineers with the group of component manufacturer industry (~50%), academia (~ 20%) and end-users (~ 20% mainly automotive). The space industry was represented by the presence of ESA ESTEC and Jacobs Engineering Inc/NASA. The Hot Panel Discussion dug into details of MLCC BIAS Ageing in an open exchange of opinion between five MLCC manufacturers and automotive user.