Changes to SMDs 5962-12227 and 5962-13207 of MAGNETORESISTIVE RAMs (MRAM)
- Posted by Manuel Padial Pérez
- On September 29, 2019
- 0
Device type variants 03 and 04 of SMDs 5962-12227 and 5962-13207, directly replace the variants 01 and 02, respectively, whose current status becomes End of Life (EOL).
In addition to the wafer hot probe operation, device type variants 03 and 04 include cold (-40ºC) wafer probe as part of production flow, as well.
Quality levels ready to be shipped are QML Q (device type variant 03) and QML Q+ (device type variant 04).
So far, QML V quality level is not currently available from an approved source of supply.
Device type variant 04 provide QML Q product with additional testing (so called QML Q+) as specified in paragraph 4.2.1d of SMDs 5962-12227 and 5962-13207:
- 100% internal visual, Test Method 2010 condition A of MIL-STD-883.
- 100% PIND (Single pass).
- Serialization.
- 100% X-ray (Top view only).
- Group A.
- Dynamic burn-in at +125ºC for 240 hours or equivalent, deltas, PDA (3%) for Functional Test only, and PDA (5%) for DC and Functional Test combined.
- Static burn-in I and II (Test Method 1015 of MIL-STD-883).
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