ALTER Laboratory Services Brochures

• Visual inspection at high and low magnifications (x1 to x1450).
• Dice Inspection at high and low magnifications (x1 to x1450).
• Radiographic inspection in real time 2D / 3D.
• Marking permanence (resistance to solvents test).
• External visual inspection with the scanning electron microscope (SEM) using low vacuum capability (x8 to x20.000).
• PIND test (Particle Impact Noise Detection) up to 2000 G and 250 Hz.
• Real-time radiographic inspection with 3D computerized tomography and virtual micro-sectioning capabilities.
• SAM (Scanning Acoustic Microscopy). A, B & C modes with acoustic tomography 3D rebuild.
• Seal (fine and gross leaks).
• Lock-in thermography for assembled boards, components, dice and active metallization. Fast response thermograph, up to 200Hz.
• Lead material verification: lead-free avoidance for space suitability. Prohibited materials analysis.
• Material analysis (EDX and XRF options available).

• Internal visual inspection at low and high magnification (x1 to x700).
• De-capping: manual or automatically controlled chemical etching with copper protection function.
• FIB (Focused Ion Beam) for die micro-sectioning, with microanalysis mapping.
• Cross-sectioning on passive parts and assembled PCB for soldering analysis.
• SEM I – SEM II / FIB inspections, including EDX micro-analysis mapping.
• Plasma etching (for glassivation removal).
• Lid torque.
• Bond pull. Bond shear. Die shear. Substrate attach strength.
• Lead fatigue.
• Dye penetrant.
• Solderability and wetting balance test.
• Terminal strength up to 50 Kg.
• Material strength up to 2000 Kg (tensile and compressive).
• Mating and un-mating force for connectors. Contact retention test. Contact engagement and separation force.
• Endurance test for connectors, switches, relays.
• Vibration.
• Mechanical shock.
• Infrared spectroscopy (Transmission mode in KBr pellets, Attenuated Total Reflectance (ATR) & Infrared Microscopy).

• Burn-in and life test with biasing and environmental real-time monitoring. Nitrogen atmosphere (optional).
• Temperature cycling (+300 ºC to -185 ºC with 45 ºC/min temperature ramps).
• Thermal shock (+300 ºC to -185 ºC with 45 ºC/min temperature ramps).
• Plastic package preconditioning (baking).
• Hot and cold storage with monitored RH conditions.
• Salt atmosphere testing.
• HAST (pressure cooking).
• Humidity test 85/85.
• Moisture resistance test.

• Development of complete test solutions (hardware & software) for our in-house Testing equipment.
• Electrical test support for Digital, Analog and Mixed Signal devices.
• ASIC design support (no licence ownership, VPN).
• FPGA and embedded systems programming.
• Electronic system design failure analysis.
• Complex Circuit Schematic Design.
• PCB layout design for RF microwave, high speed digital, analog, environmental test and complex solutions (up to 16 layers).
• Power and signal integrity layout simulation.
• PCB assembly and verification.
• 3D Mechanical design.

• Qualification Bare PCB:
  • Dimensional measurements
  • Microsectioning
• Qualification assembled PCB:
  • Temperature cycling
  • Vibration test
  • Microsectioning analysis
• Press-fit connector Qualification:
  • Temperature cycling
  • Vibration test
  • Microsectioning analysis
• Wire crimping Evaluation
• Component microsectioning analysis

Acreditation:

• Qualification assembled PCB testing processes accredited ISO/IEC 17025 for:

• • ECSS-Q-ST-70-38
  • ECSS-Q-ST-70-08C

• Power characterization of RF/MW devices up to 50 GHz.
• Temperature characterization of RF/MW devices up to 50 GHz.
• Screening and Life testing of RF/MW devices up to 50 GHz.
• Characterization on LCR devices up to 3 GHz.
• Non-destructive test fixture design and manufacturing for RF/MW devices up to 50 GHz.
• Design and manufacturing of RF boards with precise impedance adjusting.
• Design and manufacturing of fixed circuit impedance adaptors (up to 50 GHz).
• Design of RF/MW filter (up to 50 GHz).
• Design and manufacturing of customized calibration kits for high frequency devices (up to 50 GHz).
• Dynamic impedance adaptation using RF tuners (up to 8 GHz).
• Signal Noise measurement on high frequency devices (up to 50 GHz).
• Characterization of RF/MW multiport devices (up to 50 GHz).
• Verification of dimensions and material roughness analysis of RF/MW boards and waveguide.

• Small leakage current measurement (fA).
• Measurement and testing of magnetic devices.
• Measurement and testing of high power passive and discrete devices.
• Measurement of high speed and precision converters A/D & D/A up to 24 bits.
• Measurement of 1024 I/O digital devices up to 1 Gb/s.
• Mixed signal ASIC measurement.
• High precision oscillators with low phase noise measurement.
• Dielectric withstanding voltage up to 12 KV.
• High power discrete devices.

• T.I.D. (Total Ionizing Dose) over:
  • Materials
  • Individual components
  • Complete boards
  • Systems and equipments
• S.E.E. (Single Event Effects).
  • S.E.U. (Single Event Upset).
  • S.E.L. (Single Event Latch-up).
  • S.E.T. (Single Event Transient).
  • S.E.B. (Single Event Burn-out).
  • S.E.G.R. (Single Event Gate Rupture).
  • S.E.D.R. (Single Event Dielectric Rupture).
  • S.H.E. (Single Event Hard Error).
  • S.E.F.I. (Single Event Functional Interrupt).
  • S.E.S.B. (Single Event Snap Back).
  • S.E.D. (Single Event Disturb).
• Proton and neutron testing:
  • S.E.E. and D.D. (Displacement Damage).
  • A.S.E.R. (Accelerated Soft Error Rate Test).

• ALTER’s own radiation laboratory: RADLAB.
• Full availability 24/7 having the most advanced tester just where the irradiation lab is located, the electrical measurements can be done with no delay, minimizing thus TDE (Time Dependent Effects).
• In-flux testing option is available.
• Wide range of dose rates from (0 to >100 krad(Si)/h).
• Elevated & Cryogenic temperature irradiation, in accordance with MIL-STD-883 Test Method 1019.
• High uniformity irradiation test areas available (uniformity > 99%). Minimum uniformity of radiation field (>90%) guaranteed for all test areas.
• Exhaustive, remote monitoring of ambient conditions (pressure, temperature and humidity), dose rate, accumulated dose and biasing conditions.
• More than 27 years of cumulated experience in radiation.
• All test aspects managed during the whole process (boards design & manufacturing, testing, measurement, reporting, etc)

Acreditation:

• Radiation testing processes accredited ISO/IEC 17025 for:
  • ESA SCC 22900.
  • MIL-STD-883 T.M. 1019.
  • MIL-STD-750 T.M. 1019.
• Audited DLA MIL, NASA and ESA for “Laboratory Suitability for all Defense Logistics Agency’s radiation test methods”.
• Submitted to an ESA dosimetry intercomparison exercise.

• Scanning Acoustic Microscopy. Confocal inspection
• Multi-focal imaging
• Thought transmission ultrasound inspection
• A-scan, peak amplitude and phase inversion analyses.
• Detection of micrometric features of submicrometric thickness
• Depth mapping
• Non-destructive visual crossectioning
• Fourier transform data treatment
• Post-inspection moisture removal

• Analysis and review of customer requirements and preparation of PA and safety plan
• Providing engineering support to all activities, verifying compliance to Product Assurance requirements
• Technologies and Parts selection to meet the customer/project requirements
• Generation, review, discussion and approval of DCLs, PADs, specifications, technical notes and associated support documentation for compliance to project requirements.
• Generation, review, discussion and approval of evaluation, qualification, LAT, DPA, QCI, RVT and upscreening plans and any reports which may be necessary for PAD approval/fulfilment or project requirements.
• Technology and product assurance assessment based on mission profile, from COTS to class 1 projects
• Audits and inspection at manufacturers and supplier premises as part of valuations, Precap and buy-off inspections
• Review of radiation documents and test plans
• Preparation and management of RFWs/RFDs, NCRs and participation in NRBs/MRBs
• Alert and Obsolescence Management
• Organization and attendance to PCBs/ERCBs
• Technical support and review for radiation analysis, WCA, thermal analysis and further EIDP documents related to EEE parts
• Chasing actions to close them

• Sine vibration
• Random Vibration
• Sine on random vibration
• Random on random vibration
• Electrical monitoring during mechanical tests
• Classic mechanical shock
• SRS shock
• Product qualification
• ​Product certification
• Quality assurance
• Accelerated life test
• Prototype evaluation
• Mechanical interfaces design and FEM analysis
• Fixing tools manufacturing and validation for test

Acreditations:

• ​Qualification assembled PCB testing processes accredited ISO/IEC 17025 for:

ECSS-Q-ST-70-38
​ECSS-Q-ST-70-08C

MIL-STD-883 and ESCC Standards Capabilities

• RF Module Packaging 
• Photonic Packaging
• Image Sensor Assembly 
• LED CHIP On Board
• System In Package

• Experienced end-to-end Manufacturer:
  • wafer processing though to finished
  • packaged product
  • ISO7 Clean Room assembly
  • Optoelectronic & Optical Packaging
  • Microelectronic & MEMS Packaging
  • Electrical and optical test
• Thin wafer and die handling
  • Dicing of thin wafers (>100µm)
  • Handling of thin die (e.g 50u thick , 15mm x 15mm on a side)
  • Die handling to 250 µm on a side
  • Die over hang and bonding to unsupported die edges
• Die Attach
  • High performance epoxies
  • Solder die attach
  • Pick from film/frame, waffle or gel pack.
  • Flip-chip attach & Au stud bumping
• Wire-bonding
  • Low loop heights (less than 75µm with 20µm wire diameter)
  • Reverse bonding (loop heights <50um)
  • Small diameter wire (17u min)
  • Longer wire bond lengths (~6mm with 25µm wire diameter) Overhang bonds
  • Die to Die bonding
  • Variety of wire bond thicknesses to control wire sway.
  • Stand-off stitch (wire to bump)
• Sealing
  • Seam seal
  • TO Can projection weld
  • Solder seal
  • Vacuum packaging
  • Fine and gross leak test