EDPS 2019

EDPS Symposium History

The EDPS Workshop, which in past years took place in Monterey, California, now takes place in the San Jose area at the SEMI facility in Milpitas, CA, emphasized both the here and now and the future of efficient electronics design and manufacturing process and methodology. Attendees of this elite workshop have met each year since 1993. It has attracted some of the most far-seeing people in electronics design and manufacturing as speakers. If you need to know where the industry is and where it’s going with respect to design and manufacturing, and specific methodologies and techniques of efficient design and manufacturing, you should consider attending this coming year.

The 2019 Electronic Design Process Symposium will be a leading forum for advanced chip and systems design processes development and CAD methodologies.
Recent advances in computational power, data science technology, and associated applications have led to the development and proliferation of machine learning, intelligent manufacturing, and predictive design methodologies. New techniques are also emerging to enable reduced NRE and faster time to market, which are critical components in any semiconductor business.

Possible EDPS 2019 Efficient Session Themes tentatively Include:

• Cyber Systems Design with emphasis on security
• Machine Learning in System Design and EDA
• Smart Manufacturing
• Innovative Designs and Design Techniques
• Systems Synthesis
• Smart Verification
• System reliability

Authors should submit full-length original and unpublished papers along with author contact information. Proposals for special, poster, and panel sessions may also be submitted; a 1-page description along with organizer contact information is required.

Send papers or other Proposals
with “2019 Paper Proposal” in the “Subject:” line to:
edps-commmittee@googlegroups.com.

Tentative Important Dates:

• Jul. 15 – Abstract Submission Deadline
• Jul. 31 – Acceptance Deadline
• Aug. 31 – Camera Ready Copy of Final Presentation
• Oct. 3-4 – On-site Registration

Program Info.: 

Thursday, October 3rd, 2019

• Session 1: Innovate Design Techniques
• Session 2: Cyber Security
• Session 3: Advanced Packaging

Friday, October 4th, 2019

• Session 4: AI for Design and Manufacturing
• Session 5: System Reliability for ADAS, AI, 5G, and Photonics
• Symposium Wrapup