MIL-STD-883 METHOD 2003 – Solderability Testing
- Posted by Manuel Padial Pérez
- On July 23, 2020
- 0
Mil-Std-883 Method 2003- Solderability Testing employs the Dip and Look Method, requiring the following equipment:
- A solder pot to maintain solder at a specified temperature.
- A steam aging equipment for ‘aging’ the samples prior to testing
- A dipping mechanism capable of controlling the rates of immersion and emersion and dwell time of the terminations.
- A microscopy system to facilitate the external visual inspection at a minimum magnification of 10X.
The general solderability test procedure consists of the following steps following the Mil-Std-883 Method 2003:
- Proper preparation of the samples which must not include wiping, cleaning, scraping, or abrasive cleaning of the terminations to be tested.
- Aging of the samples in a steam ager, consisting on exposing the surfaces to be tested to water vapour for 8 hours and drying them, either by baking at 100ºC for no more than 1 hour in a dry atmosphere or air drying the mat ambient temperature for a minimum of 15 minutes.
- Proper application of flux to the terminations.
- Solder dipping by immersing the terminations in static solder at a uniform temperature of 245ºC +/- 5º C.
- Examination of the terminations at 10-15X magnification.
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Solderability Testing
The main criterion for acceptable solderability is 95% coverage of the dipped portion of the terminations by a new and continuous solder coating. Thus, pinholes, voids, porosity, nonwetting, or dewetting must not exceed 5% of the total dipped area.
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Lead the Technical Content Maintenance Team of doEEEt platform. at Alter Technology
Manuel Padial has a Degree in Industrial Electronic. Engineering and a Master (M.Eng.)/Advanced Degree in Electrical and Electronic Engineering.
Since 2000 in Alter Technology, as EEE Parts Engineer, first in the Engineering and Materials Management Department, has given technical support to customers in many different space programmes. And later on, as Coordinator of the Parts Engineering and Purchasing Department, has been in charge of guarantee the proper EEE Parts selection/definition/testing to ensure the technical/schedule/budget compliance to projects requirements. Currently and since 2017 is leading the Technical Content Maintenance Team of doEEEt platform.
With the continuous maintenance of the platform technical content, doEEEt provides to the space community the most updated and complete information about Hi-Rel EEE components, related documentation, and reports, as well as any associated procurement and testing activities.
Since 2000 in Alter Technology, as EEE Parts Engineer, first in the Engineering and Materials Management Department, has given technical support to customers in many different space programmes. And later on, as Coordinator of the Parts Engineering and Purchasing Department, has been in charge of guarantee the proper EEE Parts selection/definition/testing to ensure the technical/schedule/budget compliance to projects requirements. Currently and since 2017 is leading the Technical Content Maintenance Team of doEEEt platform.
With the continuous maintenance of the platform technical content, doEEEt provides to the space community the most updated and complete information about Hi-Rel EEE components, related documentation, and reports, as well as any associated procurement and testing activities.
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