Advances in Printed and Ceramic Microsystems – ISSE 2019 –

ISSE is a series conferences and a network of electronics packaging education to provide a European forum for the exchange of information between senior and junior scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and microelectronics technology and packaging.

The International Spring Seminar on Electronics Technology encompassing all topics around electronics technology all over the world. The main focus of the ISSE is both directed in bringing deeper knowledge and information of electronics technology, and, especially for young researchers, to increase or confirm a motivation for intensifying their engagement in the field of electrical engineering.

TOPICS OF ISSE 2019:

1. New Materials, Components, and Processes
2. Thermal Management
3. Advanced Packaging and Interconnection Technologies
4. Testing, Reliability and Quality Management
5. Process Modelling and Simulation
6. Environmental and Ecological Effects in Electronics Technology
7. Nanotechnology, Nanomaterials, and Nanoelectronics
8. Signal Integrity and Electromagnetic Compatibility
9. Sensors, Actuators, and Microsystems
10. Educational and Information Technologies in Electronics Manufacturing
11. Discrete and Integrated Components